LD132A272KAB4A_技术文档

A KYOCERA GROUP COMPANY

AVX

Surfa c e Mount

Ce ra m ic Ca pa c itor Produc ts

Ceramic Chip Capacitors

Table of Contents

How to Order - AVX Part Number Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

C0G (NP0) Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7

U Dielectric

General Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Capacitance Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10

Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

X7R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-15

X7S Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

X5R Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-22

Y5V Dielectric

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

MLCC Tin/Lead Termination

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27-31

Automotive MLCC

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-33

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34-35

MLCC with Soft Termination

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Specifications and Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37-38

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Capacitor Array

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Capacitance Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Multi-Value Capacitor Array (IPC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Part and Pad Layout Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Low Inductance Capacitors

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44-45

LICC (Low Inductance Chip Capacitors) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46-47

IDC (InterDigitated Capacitors). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48-49

LICA (Low Inductance Decoupling Capacitor Arrays) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50-51

High Voltage Chips for 600V to 5000V Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52-53

MIL-PRF-55681/Chips

Part Number Example (CDR01 thru CDR06) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Military Part Number Identification (CDR01 thru CDR06) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Part Number Example (CDR31 thru CDR35) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

Military Part Number Identification (CDR31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Military Part Number Identification (CDR32) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Military Part Number Identification (CDR33/34/35) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Packaging of Chip Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

Embossed Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Paper Carrier Configuration - 8 & 12mm Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Bulk Case Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Basic Capacitor Formulas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65-69

Surface Mounting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70-73

1

How to Order

Part Number Explanation

Commercial Surface Mount Chips

EXAMPLE: 08055A101J AT2A

0805

5

A

101

J *

A

T

2

A

Size

Voltage

Dielectric

A = NP0(C0G)

C = X7R

D = X5R

G = Y5V

U = U Series

W = X6S

Z = X7S

Capacitance

2 Sig. Fig +

No. of Zeros

Examples:

100 = 10 pF

101 = 100 pF

102 = 1000 pF

223 = 22000 pF

224 = 220000 pF M = ±20%

105 = 1µF

106 = 10µF

107 = 100µF

For values below

10 pF, use “R”

in place of

Decimal point, e.g.,

9.1 pF = 9R1.

Tolerance

Failure

Rate

A = N/A

Terminations

T = Plated Ni

and Sn

7 = Gold Plated

J = Tin/Lead

Packaging

Available

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

(L" x W") 4 = 4V

B = ±.10 pF

0201

0402

0603

0805

1206

1210

1812

1825

2220

2225

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

1 = 100V

2 = 200V

7 = 500V

C = ±.25 pF

D = ±.50 pF

F = ±1% (≥ 10 pF)

G = ±2% (≥ 10 pF)

J = ±5%

4 = Automotive

Contact

Factory For

1 = Pd/Ag Term

Z = Soft

K = ±10%

Contact

Factory For

Multiples

Z = +80%, -20%

P = +100%, -0%

Termination

Contact Factory for

Special Voltages

F = 63V

* = 75V

E = 150V 8 = 400V

V = 250V

* B, C & D tolerance for ≤10 pF values.

Standard Tape and Reel material (Paper/Embossed)

depends upon chip size and thickness.

9 = 300V

X = 350V

See individual part tables for tape material type for

each capacitance value.

High Voltage Surface Mount Chips

EXAMPLE: 1808AA271KA11A

1808

A

271

K

A

1

1A

AVX

Style

1206

1210

1808

1812

1825

2220

2225

3640

Voltage

Temperature Capacitance Capacitance

Failure

Rate

A=Not

Termination

1= Pd/Ag

T = Plated Ni

and Sn

Packaging/Marking

1A = 7" Reel

Unmarked

3A = 13" Reel

Unmarked

C = 600V

A = 1000V

S = 1500V

G = 2000V

W = 2500V

H = 3000V

J = 4000V

K = 5000V

Coefficient

A = C0G

C = X7R

Code

Tolerance

C0G: J = ±5%

K = ±10%

(2 significant digits

+ no. of zeros)

Examples:

Applicable

M = ±20%

10 pF = 100

100 pF = 101

X7R: K = ±10%

M = ±20%

9A = Bulk/Unmarked

1,000 pF = 102

22,000 pF = 223

Z = +80%,

-20%

220,000 pF = 224

1 µF = 105

2

How to Order

Part Number Explanation

Capacitor Array

EXAMPLE: W2A43C103MAT2A

W

2

A

4

3

C

103

M

A

T

2A

Style

Case

Size

1 = 0405

2 = 0508

3 = 0612

Array Number

of Caps

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

Dielectric Capacitance Capacitance Failure

Termination

Code

T = Plated Ni

and Sn

Packaging &

Quantity

Code (In pF)

2 Sig Digits +

Number of

Zeros

Tolerance

J = ±5%

K = ±10%

M = ±20%

Rate

A = NP0

C = X7R

D = X5R

Code

2A = 7" Reel (4000)

4A = 13" Reel (10000)

2F = 7" Reel (1000)

Low Inductance Capacitors (LICC)

EXAMPLE: 0612ZD105MAT2A

0612

Z

D

105

M

A

T

2

A

Size

0306

0508

0612

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = ±10%

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

See Page 51

for Codes

A = N/A

T = Plated Ni

and Sn

M = ±20%

J = Tin/Lead

Interdigitated Capacitors (IDC)

EXAMPLE: W3L16D225MAT3A

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Code (In pF) Tolerance

2 Sig. Digits +

Number of

Zeros

Style Case

Low

Number

of

Terminals

1 = 8 Terminals

Voltage Dielectric

4 = 4V C = X7R

6 = 6.3V D = X5R

Z = 10V

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

Size Inductance

2 = 0508

Rate

T = Plated Ni

and Sn

Available

1=7" Reel

M = ±20

A = N/A

3 = 0612

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

Y = 16V

Decoupling Capacitor Arrays (LICA)

EXAMPLE: LICA3T183M3FC4AA

4

A

LICA

3

T

183

M

3

F

C

# of

Caps/Part

1 = one

2 = two B = Established B = No Bar

4 = four

Inspection

Code

A = Standard

Code

Face

A = Bar

Style Voltage

&

Dielectric Cap/Section Capacitance Height

5V = 9 D = X5R (EIA Code) Tolerance Code

M = ±20% 6 = 0.500mm

P = GMV 3 = 0.650mm H = C4 Solder

1 = 0.875mm

Balls–Low ESR 8 = 2"x2" Black Waffle

Termination

F = C4 Solder

Reel Packaging

M = 7" Reel

Size

10V = Z T = T55T

25V = 3 S = High K

T55T

Balls- 97Pb/3Sn R = 13" Reel

6 = 2"x2" Waffle Pack

Reliability

Testing

C = Dot, S55S

Dielectrics

5 = 1.100mm P = Cr-Cu-Au

7 = 1.600mm N = Cr-Ni-Au

X = None

Pack

7 = 2"x2" Waffle Pack

w/ termination

facing up

A = 2"x2" Black Waffle

Pack

w/ termination

facing up

C = 4"x4" Waffle Pack

w/ clear lid

3

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the “tempera-

ture-compensating,” EIA Class I ceramic materials. Modern

C0G (NP0) formulations contain neodymium, samarium and

other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable capacitor

dielectrics available. Capacitance change with temperature

is 0 ±30ppm/°C which is less than ±0.3% ∆ C from -55°C

to +125°C. Capacitance drift or hysteresis for C0G (NP0)

ceramics is negligible at less than ±0.05% versus up to

±2% for films. Typical capacitance change with life is less

than ±0.1% for C0G (NP0), one-fifth that shown by most

other dielectrics. C0G (NP0) formulations show no aging

characteristics.

The C0G (NP0) formulation usually has a “Q” in excess

of 1000 and shows little capacitance or “Q” changes with

frequency. Their dielectric absorption is typically less than

0.6% which is similar to mica and most films.

PART NUMBER (see page 2 for complete part number explanation)

0805

A

101

J

A

T

2

A

5

Size

(L" x W")

Dielectric

C0G (NP0) = A

Capacitance

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

B = ±.10 pF (<10pF)

C = ±.25 pF (<10pF)

D = ±.50 pF (<10pF)

F = ±1% (≥ 10 pF)

G = ±2% (≥ 10 pF)

J = ±5%

7 = Gold Plated

Contact

Factory For

1 = Pd/Ag Term

Contact

Factory

For

Multiples

K = ±10%

Temperature Coefficient

Insulation Resistance vs Temperature

ꢀ Capacitance vs. Frequency

10,000

1,000

100

+2

+1

Typical Capacitance Change

Envelope: 0 30 ppm/°C

+0.5

0

-1

-2

-0.5

0

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

-55 -35

+125

-15 +5 +25 +45 +65 +85 +105

40

60

80

100

0

20

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

0805 - C0G (NP0)

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

1000 pF - C0G (NP0) vs X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

1000 pF - C0G (NP0)

10 pF vs. 100 pF vs. 1000 pF

100,000

10

10.00

1206

0805

1812

1210

X7R

NPO

10,000

1,000

100

1.00

1.0

0.1

0.10

0.01

10 pF

10.0

1.0

0.1

100

1000

10

100 pF

1000 pF

100

1000

10

Frequency, MHz

1

100

Frequency, MHz

1000

10

4

C0G (NP0) Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

NP0 Specification Limits

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF

1.0 kHz ± 10% for cap > 1000 pF

Voltage: 1.0Vrms ± .2V

-55ºC to +125ºC

Within specified tolerance

<30 pF: Q≥ 400+20 x Cap Value

≥30 pF: Q≥ 1000

Q

100,000MΩ or 1000MΩ - µF,

whichever is less

Charge device with rated voltage for

60 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150% of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

No defects

Deflection: 2mm

Test Time: 30 seconds

±5% or ±.5 pF, whichever is greater

Resistance to

Flexure

1mm/sec

Q

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95% of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Solderability

Appearance

Capacitance

Variation

No defects, <25% leaching of either end terminal

≤ ±2.5% or ±.25 pF, whichever is greater

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Resistance to

Solder Heat

Q

Meets Initial Values (As Above)

Insulation

Resistance

Dielectric

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

Step 1: -55ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ ±2.5% or ±.25 pF, whichever is greater

≤ 3 minutes

Thermal

Shock

Q

Meets Initial Values (As Above)

Step 3: +125ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

Insulation

Resistance

Dielectric

≤ 3 minutes

Repeat for 5 cycles and measure after

24 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤ ±3.0% or ± .3 pF, whichever is greater

Charge device with twice rated voltage in

test chamber set at 125ºC ± 2ºC

for 1000 hours (+48, -0).

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Q

Load Life

(C=Nominal Cap)

Insulation

Resistance

Dielectric

Remove from test chamber and stabilize at

room temperature for 24 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

Strength

Appearance

Capacitance

Variation

≤ ±5.0% or ± .5 pF, whichever is greater

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≥ 30 pF:

≥10 pF, <30 pF:

<10 pF:

Q≥ 350

Q≥ 275 +5C/2

Q≥ 200 +10C

Load

Humidity

Q

Insulation

Resistance

Dielectric

Strength

Remove from chamber and stabilize at

room temperature for 24 ± 2 hours

before measuring.

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

5

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

MM

(in.)

0.60 0.03

1.00 0.10

1.60 0.15

2.01 0.20

3.20 0.20

(L) Length

(0.024 0.001)

(0.040 0.004)

(0.063 0.006)

(0.079 0.008)

(0.126 0.008)

MM

(in.)

0.30 0.03

(0.011 0.001)

0.50 0.10

(0.020 0.004)

0.81 0.15

(0.032 0.006)

1.25 0.20

(0.049 0.008)

1.60 0.20

(0.063 0.008)

(W) Width

MM

(in.)

0.15 0.05

(0.006 0.002)

0.25 0.15

(0.010 0.006)

0.35 0.15

(0.014 0.006)

0.50 0.25

(0.020 0.010)

0.50 0.25

(0.020 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

10

16

25

A

16

C

25

C

50

C

6.3

G

25

G

50

G

100

G

16

J

N

25

J

N

50

J

M

100

J

200

J

16

J

M

25

J

M

50

J

M

100

J

M

P

200

J

500

J

Cap

(pF)

A

82

A

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

J

M

P

M

J

M

Q

W

L

ꢀ

T

ꢀ

Cap

(µF)

t

WVDC

10

16

25

16

25

50

6.3

25

50

100

16

25

50

100

200

16

25

50

100

200

500

SIZE

0201

0402

0603

0805

1206

Letter

Max.

Thickness (0.013)

A

0.33

C

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.56

(0.022)

0.94

(0.037)

PAPER

EMBOSSED

6

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1812

1825

2225

Soldering

Reflow Only

Packaging

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

5.72 ± 0.25

(0.225 ± 0.010)

MM

(in.)

(L) Length

MM

(in.)

2.50 ± 0.20

(0.098 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

6.40 ± 0.40

(0.252 ± 0.016)

6.35 ± 0.25

(0.250 ± 0.010)

(W) Width

MM

(in.)

0.50 ± 0.25

(0.020 ± 0.010)

0.61 ± 0.36

(0.024 ± 0.014)

0.61 ± 0.36

(0.024 ± 0.014)

0.64 ± 0.39

(0.025 ± 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

500

25

50

100

200

500

50

100

200

500

50

100

200

500

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

W

L

ꢀ

T

ꢀ

3.9

4.7

5.6

6.8

8.2

t

10

12

J

15

J

18

J

22

J

27

J

33

J

39

J

47

J

56

J

68

J

82

J

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

M

J

N

J

N

J

M

Q

K

M

X

K

M

P

K

M

K

P

M

P

Q

X

M

P

M

P

M

Y

P

Y

Z

J

M

X

P

Cap

(µF)

Q

P

Y

P

0.068

0.082

0.1

X

Y

X

Y

P

Q

50

WVDC

25

50

100

200

500

25

50

100

200

500

50

100

200

500

100

200

500

SIZE

1210

1812

1825

Q

1.78

(0.070)

2225

Letter

Max.

Thickness

A

0.33

(0.013)

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

M

N

1.40

(0.055)

P

1.52

(0.060)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.94

(0.037)

1.02

(0.040)

1.27

(0.050)

PAPER

EMBOSSED

7

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

GENERAL INFORMATION

are met on each value producing lot to lot uniformity.

Sizes available are EIA chip sizes 0603, 0805, and 1210.

“U” Series capacitors are C0G (NP0) chip capacitors spe-

cially designed for “Ultra” low ESR for applications in the

communications market. Max ESR and effective capacitance

DIMENSIONS: inches (millimeters)

0402

0603

0805

1210

A

E

A

E

C

B

C

B

C

D

E

inches (mm)

Size

A

B

C

D

E

0402

0603

0805

1210

0.039±0.004 (1.00±0.1)

0.020±0.004 (0.50±0.1)

0.024 (0.6) max

N/A

0.060±0.010 (1.52±0.25) 0.030±0.010 (0.76±0.25)

0.036 (0.91) max

0.010±0.005 (0.25±0.13)

0.030 (0.76) min

0.020 (0.51) min

0.079±0.008 (2.01±0.2)

0.126±0.008 (3.2±0.2)

0.049±0.008 (1.25±0.2)

0.098±0.008 (2.49±0.2)

0.040±0.005 (1.02±0.127) 0.020±0.010 (0.51±0.255)

0.050±0.005 (1.27±0.127) 0.025±0.015 (0.635±0.381) 0.040 (1.02) min

HOW TO ORDER

0805

1

U

100

J

A

T

2

A

Case Size

0402

Dielectric =

Ultra Low

ESR

Capacitance

Tolerance

Code

Termination

T= Plated Ni

and Solder

Special

Code

A = Standard

0603

0805

1210

B = ±0.1pF

C = ±0.25pF

D = ±0.5pF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

Voltage

Code

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Failure Rate

Code

Packaging

Code

2 = 7" Reel

4 = 13" Reel

9 = Bulk

A = Not

Capacitance

Applicable

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or after

“R” significant figures.

ELECTRICAL CHARACTERISTICS

Dielectric Working Voltage (DWV):

Capacitance Values and Tolerances:

Size 0402 - 0.2 pF to 22 pF @ 1 MHz

Size 0603 - 1.0 pF to 100 pF @ 1 MHz

Size 0805 - 1.6 pF to 160 pF @ 1 MHz

Size 1210 - 2.4 pF to 1000 pF @ 1 MHz

250% of rated WVDC

Equivalent Series Resistance Typical (ESR):

0402

0603

0805

1210

-

See Performance Curve, page 9

Temperature Coefficient of Capacitance (TC):

0±30 ppm/°C (-55° to +125°C)

Marking: Laser marking EIA J marking standard

(except 0603) (capacitance code and

tolerance upon request).

Insulation Resistance (IR):

10¹²Ω min. @ 25°C and rated WVDC

10¹¹Ω min. @ 125°C and rated WVDC

Working Voltage (WVDC):

MILITARY SPECIFICATIONS

Size

Working Voltage

50, 25 WVDC

Meets or exceeds the requirements of MIL-C-55681

0402

0603

0805

1210

-

200, 100, 50 WVDC

200, 100 WVDC

8

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

CAPACITANCE RANGE

Size

Cap (pF) Tolerance 0402 0603 0805 1210

Size

Cap (pF) Tolerance 0402 0603 0805 1210

F,G,J,K,M N/A 100V 200V 200V

Size

Available

Cap (pF) Tolerance 0402 0603 0805 1210

7.5

8.2

9.1

10

11

12

13

15

18

20

22

24

27

30

33

36

39

43

47

51

56

68

75

82

91

B,C,J,K,M 50V 200V 200V 200V

100

110

120

130

140

150

160

180

200

220

270

300

330

360

390

430

470

510

560

620

680

750

820

910

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

B,C

50V N/A N/A N/A

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

B,C,D

ꢁ

50V 200V 200V N/A

ꢁ

50V

ꢁ

B,C,J,K,M

F,G,J,K,M

B,C

ꢁ

B,C,D

ꢁ

50V

N/A 200V

N/A

ꢁ

B,C,D

ꢁ

50V

N/A

200V

ꢁ

100V

ꢁ

B,C,D

B,C,J,K,M

ꢁ

F,G,J,K,M

1000 F,G,J,K,M

ULTRA LOW ESR, “U” SERIES

TYPICAL ESR vs. FREQUENCY

0402 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0603 “U” SERIES

1

10 pF

15 pF

3.3 pF

3.9 pF

4.7 pF

5.1 pF

6.8 pF

10.0 pF

15.0 pF

0.1

0.01

2500

0

500

1000

Frequency (MHz)

2000

500

1000

Frequency (MHz)

2000

1500

TYPICAL ESR vs. FREQUENCY

1210 “U” SERIES

TYPICAL ESR vs. FREQUENCY

0805 “U” SERIES

1

100 pF

10.0 pF

10 pF

100 pF

0.1

300 pF

0.01

2500

0

500

1000

2000

500

1000

Frequency (MHz)

2000

1500

Frequency (MHz)

ESR Measured on the Boonton 34A

9

RF/Microwave C0G (NP0) Capacitors

Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors

F r e q u e n c y ( G H z )

10

Designer Kits

Communication Kits “U” Series

“U” SERIES KITS

Solder Plated, Nickel Barrier

0402

0603

Kit 5000 UZ*

Kit 4000 UZ**

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Cap.

Tol.† Value

pF

Tol.†

0.5

1.0

1.5

1.8

2.2

2.4

3.0

3.6

B

4.7

5.6

6.8

B

J

1.0

1.2

1.5

1.8

2.0

2.4

2.7

3.0

3.3

3.9

4.7

5.6

±.25pF

6.8

7.5

8.2

±.25pF

±5%

8.2

10.0

12.0

15.0

18.0

22.0

27.0

33.0

39.0

47.0

10.0

12.0

15.0

J

* 150 Capacitors 10 each of 15 values.

±5%

** 240 Capacitors 10 each of 24 values.

0805

1210

Kit 3000 UZ***

Kit 3500 UZ***

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Cap.

Value

pF

Cap.

Tol.† Value

pF

Cap.

Value

pF

Tol.†

1.0

1.5

2.2

2.4

2.7

3.0

3.3

3.9

4.7

5.6

C

7.5

8.2

9.1

10.0

12.0

15.0

18.0

22.0

24.0

27.0

C

J

33

36

39

47

56

68

82

100

130

160

J

2.2

2.7

4.7

5.1

6.8

8.2

9.1

10

C

J

18

20

24

27

30

36

39

47

51

56

J

68

82

J

100

120

130

240

300

390

470

680

13

15

J

*** 300 Capacitors 10 each of 30 values.

†Tolerance – B = ±0.1pF

C = ±0.25pF

J = ±5%

11

X7R Dielectric

General Specifications

X7R formulations are called “temperature stable” ceramics

and fall into EIA Class II materials. X7R is the most popular

of these intermediate dielectric constant materials. Its tem-

perature variation of capacitance is within ±15% from

-55°C to +125°C. This capacitance change is non-linear.

Capacitance for X7R varies under the influence of electrical

operating conditions such as voltage and frequency.

X7R dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capaci-

tance due to applied voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

0805

5

C

103

M

A

T

2

A

Size

(L" x W")

Voltage

4V = 4

Dielectric

X7R = C

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

J = ± 5%

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

K = ±10%

M = ± 20%

7 = Gold

Plated

Contact

Factory For

Multiples

X7R Dielectric

Insulation Resistance vs Temperature

ꢀ Capacitance vs. Frequency

Typical Temperature Coefficient

10,000

1,000

100

+30

+20

+10

10

5

0

-5

0

-10

-20

-30

-10

-15

-20

-25

0

20

40

60

80

100

120

-60 -40

100 140

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

-20

0

20 40 60 80

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7R

10

10.00

10

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

1

10

100

1000

10

100

1,000

1

10

Frequency, MHz

12

X7R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7R Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +125ºC

Within specified tolerance

≤ 2.5% for ≥ 50V DC rating

≤ 3.0% for 25V DC rating

≤ 3.5% for 16V DC rating

≤ 5.0% for ≤ 10V DC rating

100,000MΩ or 1000MΩ - µF,

whichever is less

Freq.: 1.0 kHz ± 10%

Voltage: 1.0Vrms ± .2V

For Cap > 10 µF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Note: Charge device with 150% of rated

voltage for 500V devices.

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ ±12%

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95% of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, <25% leaching of either end terminal

≤ ±7.5%

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ ±7.5%

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 ± 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with twice rated voltage in

test chamber set at 125ºC ± 2ºC

for 1000 hours (+48, -0)

≤ ±12.5%

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ ±12.5%

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

13

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

MM

(in.)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.30 ± 0.03

(0.011 ± 0.001)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

(W) Width

MM

(in.)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

100

150

220

330

16

A

16

25

50

10

16

25

50

100

10

16

25

50

100

200

10

16

25

50

100

200

500

Cap

(pF)

C

G

J

M

J

M

J

K

M

P

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

J

M

J

M

J

M

J

C

Cap

(µF

J

M

J

P

G

M

P

G

J

M

G

J

M

N

M

P

Q

W

L

1.5

2.2

3.3

ꢀ

T

ꢀ

4.7

10

t

22

47

100

WVDC

16

25

50

10

16

25

50

100

10

16

25

50

100

200

10

16

25

50

100

200

500

SIZE

0201

0402

0603

0805

1206

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

2.54

(0.100)

PAPER

EMBOSSED

14

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1210

1812

1825

2220

2225

Soldering

Reflow Only

Packaging

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

5.70 ± 0.40

(0.225 ± 0.016)

All Embossed

5.72 ± 0.25

(0.225 ± 0.010)

MM

(in.)

(L) Length

MM

(in.)

2.50 ± 0.20

(0.098 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

6.40 ± 0.40

(0.252 ± 0.016)

5.00 ± 0.40

(0.197 ± 0.016)

6.35 ± 0.25

(0.250 ± 0.010)

(W) Width

MM

(in.)

0.50 ± 0.25

(0.020 ± 0.010)

0.61 ± 0.36

(0.024 ± 0.014)

0.61 ± 0.36

(0.024 ± 0.014)

0.64 ± 0.39

(0.025 ± 0.015)

0.64 ± 0.39

(0.025 ± 0.015)

(t) Terminal

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

6.3

50

100

200

50

100

Cap

(pF)

100

150

220

W

L

ꢀ

330

T

ꢀ

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

t

J

M

N

J

M

N

J

M

P

J

M

X

J

M

P

Z

J

M

P

Cap

(µF

K

M

K

M

P

K

P

K

P

X

Z

M

X

Z

X

M

P

M

Q

J

M

P

Q

X

1.5

2.2

X

Z

3.3

4.7

10

Q

Z

22

47

100

WVDC

10

16

25

50

100

200

500

50

100

200

500

50

100

6.3

50

100

200

50

100

SIZE

1210

1812

1825

P

1.52

(0.060)

2220

2225

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

G

0.86

(0.034)

J

K

M

1.27

(0.050)

N

1.40

(0.055)

Q

1.78

(0.070)

X

Y

2.54

(0.100)

Z

0.33

(0.013)

0.71

(0.028)

0.94

(0.037)

1.02

(0.040)

2.29

(0.090)

2.79

(0.110)

PAPER

EMBOSSED

15

X7S Dielectric

General Specifications

GENERAL DESCRIPTION

X7S formulations are called “temperature stable” ceramics and fall

into EIA Class II materials. X7S is the most popular of these intermedi-

ate dielectric constant materials. Its temperature variation of capaci-

tance is within ±22% from –55°C to +125°C. This capacitance

change is non-linear.

Capacitance for X7S varies under the influence of electrical operating

conditions such as voltage and frequency.

X7S dielectric chip usage covers the broad spectrum of industrial

applications where known changes in capacitance due to applied

voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

1206

Z

105

M

A

T

2

A

Size

(L" x W")

Voltage

4 = 4V

Dielectric

Z = X7S

Capacitance Capacitance

Failure

Rate

A = N/A

Special

Code

A = Std.

Product

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = ±10%

M = ±20%

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

TYPICAL ELECTRICAL CHARACTERISTICS

X7S Dielectric

Typical Temperature Coefficient

Insulation Resistance vs Temperature

ꢀ Capacitance vs. Frequency

10,000

1,000

100

+30

+20

+10

10

5

0

-5

0

-10

-20

-30

-10

-15

-20

-25

0

-60 -40 -20

0

20 40 60 80 100 120 140

0

20

40

60

80

100

120

1KHz

10 KHz

100 KHz

1 MHz

10 MHz

Temperature (°C)

Frequency

Temperature °C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7S

0805

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7S

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7S

10

10.00

10

1206

0805

1210

1206

0805

1210

1,000 pF

10,000 pF

1.0

0.1

.01

1.00

1.0

0.10

0.01

0.1

.01

100

1,000

1

10

100

1000

10

100

1,000

1

10

Frequency, MHz

16

X7S Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X7S Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +125ºC

Within specified tolerance

≤ 2.5% for ≥ 50V DC rating

≤ 3.0% for 25V DC rating

≤ 3.5% for 16V DC rating

≤ 5.0% for ≤ 10V DC rating

100,000MΩ or 1000MΩ - µF,

whichever is less

Freq.: 1.0 kHz ± 10%

Voltage: 1.0Vrms ± .2V

For Cap > 10 µF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ ±12%

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95% of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, <25% leaching of either end terminal

≤ ±7.5%

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ ±7.5%

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +125ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 ± 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with twice rated voltage in

test chamber set at 125ºC ± 2ºC

for 1000 hours (+48, -0)

≤ ±12.5%

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ ±12.5%

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

17

X7S Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0402

0603

0805

1206

1210

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

Reflow Only

Paper/Embossed

MM

(in.)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

(W) Width

MM

(in.)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

6.3

4

6.3

10

6.3

Cap

(pF)

100

150

220

330

W

L

ꢀ

470

680

T

ꢀ

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

t

Cap

(µF

C

G

1.5

2.2

3.3

4.7

N

Q

10

22

Z

47

100

WVDC

6.3

4

6.3

10

6.3

SIZE

0402

0603

0805

1206

1210

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

PAPER

EMBOSSED

18

X5R Dielectric

General Specifications

GENERAL DESCRIPTION

• General Purpose Dielectric for Ceramic Capacitors

• EIA Class II Dielectric

• Temperature variation of capacitance is within ±15%

from -55°C to +85°C

• Well suited for decoupling and filtering applications

• Available in High Capacitance values (up to 100µF)

PART NUMBER (see page 2 for complete part number explanation)

2220

6

D

107

M

A

T

2

A

Size

(L" x W")

Voltage

4 = 4V

Dielectric

D = X5R

Capacitance Capacitance

Failure

Rate

A = N/A

Special

Code

A = Std.

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = ±10%

M = ±20%

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

D = 35V

5 = 50V

TYPICAL ELECTRICAL CHARACTERISTICS

Temperature Coefficient

Insulation Resistance vs Temperature

10,000

1,000

100

20

15

10

5

0

-5

-10

-15

-20

0

-60 -40

-20

0

+20 +40 +60 +80

20

40

60

80

100

120

Temperature °C

19

X5R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

X5R Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-55ºC to +85ºC

Within specified tolerance

≤ 2.5% for ≥ 50V DC rating

≤ 3.0% for 25V DC rating

≤ 3.5% for 16V DC rating

≤ 5.0% for ≤ 10V DC rating

100,000MΩ or 500MΩ - µF,

whichever is less

Freq.: 1.0 kHz ± 10%

Voltage: 1.0Vrms ± .2V

For Cap > 10 µF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ ±12%

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.3

90 mm

≥ 95% of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, <25% leaching of either end terminal

≤ ±7.5%

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ ±7.5%

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 ± 2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with 1.5X rated voltage in

test chamber set at 85ºC ± 2ºC for 1000 hours

(+48, -0). Note: Contact factory for specific high

CV devices that are tested at 1.5X rated voltage.

≤ ±12.5%

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ ±12.5%

Load

Humidity

≤ Initial Value x 2.0 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

20

X5R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

MM

(in.)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

(L) Length

MM

(in.)

0.30 ± 0.03

(0.011 ± 0.001)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

(W) Width

MM

(in.)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

100

150

220

330

10

16

25

A

4

6.3

10

16

25

4

6.3

10

16

25

35

6.3

10

16

25

35

50

Cap

(pF)

W

L

ꢀ

T

470

680

ꢀ

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

A

t

A

Cap

(µF

C

G

C

G

N

C

N

G

C

N

G

1.5

2.2

3.3

4.7

6.8

10

N

G

N

22

47

100

WVDC

10

16

25

4

6.3

10

16

25

4

6.3

10

16

25

35

6.3

10

16

25

35

50

SIZE

0201

0402

0603

0805

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

PAPER

EMBOSSED

21

X5R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

1206

1210

1812

Soldering

Reflow/Wave

Reflow Only

Packaging

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

MM

(in.)

(L) Length

MM

(in.)

1.60 ± 0.20

(0.063 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(W) Width

MM

(in.)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

0.61 ± 0.36

(0.024 ± 0.014)

(t) Terminal

WVDC

6.3

10

16

25

35

6.3

10

16

25

35

6.3

10

25

Cap

(pF)

100

150

220

W

L

ꢀ

330

T

ꢀ

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

6.8

10

22

47

t

Cap

(µF

M

Q

N

X

Q

Z

Q

Z

100

WVDC

6.3

10

16

25

35

6.3

10

16

25

35

6.3

10

25

SIZE

1206

1210

1812

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

PAPER

EMBOSSED

22

Y5V Dielectric

General Specifications

Y5V formulations are for general-purpose use in a limited

temperature range. They have a wide temperature character-

istic of +22% –82% capacitance change over the operating

temperature range of –30°C to +85°C.

These characteristics make Y5V ideal for decoupling applica-

tions within limited temperature range.

PART NUMBER (see page 2 for complete part number explanation)

0805

3

G

104

Z

A

T

2

A

Size

(L" x W")

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

Dielectric

Y5V = G

Capacitance Capacitance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

Z = +80 –20%

Capacitance Change

vs. DC Bias Voltage

Temperature Coefficient

Insulation Resistance vs. Temperature

10,000

1,000

100

+20

+10

0

+40

+20

0

-10

-20

-30

-40

-50

-60

-70

-80

-20

-40

-60

-80

0

-100

0

-55 -35

+125

+20

+30

+40 +50 +60

+70 +80 +90

-15 +5 +25 +45 +65 +85 +105

40

100

20

60

80

Temperature °C

% DC Bias Voltage

0.22 ꢂF - 0805

Impedance vs. Frequency

1 ꢂF - 1206

Impedance vs. Frequency

0.1 ꢂF - 0603

Impedance vs. Frequency

1,000

100

10

1,000

10,000

1,000

100

10

1

100

10

1

0.1

0.01

10,000

0.01

10,000

0.01

10,000

100,000

1,000,000

10,000,000

1,000,000

10,000,000

1,000,000

10,000,000

Frequency (Hz)

23

Y5V Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

Y5V Specification Limits

Measuring Conditions

Temperature Cycle Chamber

-30ºC to +85ºC

Within specified tolerance

≤ 5.0% for ≥ 50V DC rating

≤ 7.0% for 25V DC rating

≤ 9.0% for 16V DC rating

≤ 12.5% for ≤ 10V DC rating

100,000MΩ or 500MΩ - µF,

whichever is less

Freq.: 1.0 kHz ± 10%

Voltage: 1.0Vrms ± .2V

For Cap > 10 µF, 0.5Vrms @ 120Hz

Dissipation Factor

Charge device with rated voltage for

120 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Insulation Resistance

Dielectric Strength

No breakdown or visual defects

Appearance

Capacitance

Variation

Dissipation

Factor

No defects

Deflection: 2mm

Test Time: 30 seconds

≤ ±30%

Resistance to

Flexure

1mm/sec

Meets Initial Values (As Above)

Stresses

Insulation

Resistance

≥ Initial Value x 0.1

90 mm

≥ 95% of each terminal should be covered

with fresh solder

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

No defects, <25% leaching of either end terminal

≤ ±20%

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Resistance to

Solder Heat

Meets Initial Values (As Above)

No visual defects

≤ ±20%

Step 1: -30ºC ± 2º

Step 2: Room Temp

30 ± 3 minutes

≤ 3 minutes

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Thermal

Shock

Meets Initial Values (As Above)

Step 3: +85ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤ 3 minutes

Repeat for 5 cycles and measure after

24 ±2 hours at room temperature

Meets Initial Values (As Above)

No visual defects

Charge device with twice rated voltage in

test chamber set at 85ºC ± 2ºC

for 1000 hours (+48, -0)

≤ ±30%

≤ Initial Value x 1.5 (See Above)

≥ Initial Value x 0.1 (See Above)

Load Life

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Meets Initial Values (As Above)

No visual defects

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

≤ ±30%

Load

Humidity

≤ Initial Value x 1.5 (See above)

≥ Initial Value x 0.1 (See Above)

Meets Initial Values (As Above)

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

24

Y5V Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

0201

0402

0603

0805

1206

1210

Soldering

Reflow Only

Reflow/Wave

Reflow Only

Packaging

All Paper

Paper/Embossed

MM

(in.)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.30 ± 0.03

(0.011 ± 0.001)

0.50 ± 0.10

(0.020 ± 0.004)

.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

(W) Width

MM

(in.)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

6.3

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

Cap

(pF)

820

1000

2200

A

W

L

ꢀ

4700

0.010

0.022

A

C

T

Cap

(µF)

A

C

G

ꢀ

C

0.047

0.10

0.22

A

C

G

t

J

K

N

G

0.47

1.0

2.2

G

K

N

M

G

N

M

4.7

10.0

22.0

47.0

M

Q

N

Q

X

WVDC

6.3

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

10

16

25

50

SIZE

0201

0402

0603

0805

1206

1210

Letter

Max.

A

0.33

C

0.56

E

0.71

G

0.86

J

K

1.02

M

1.27

N

1.40

P

1.52

Q

1.78

X

2.29

Y

2.54

Z

2.79

0.94

Thickness

(0.013)

(0.022)

(0.028)

(0.034)

(0.037)

(0.040)

(0.050)

(0.055)

(0.060)

(0.070)

(0.090)

(0.100)

(0.110)

PAPER

EMBOSSED

25

MLCC Tin/Lead Termination “B”

General Specifications

AVX Corp ora tion will s up p ort thos e c us tome rs for

commercial and military Multilayer Ceramic Capacitors with

a te rmina tion c ons is ting of 5% minimum le a d. This

termination is indicated by the use of a “B” in the 12th

position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our

customers. AVX has provided in the following pages a full

range of values that we are currently offering in this special

“B” termination. Please contact the factory if you require

additional information on our MLCC Tin/Lead Termination

“B” products.

PART NUMBER (see page 2 for complete part number explanation)

LD05

A

101

J

A

B

2

A

5

Size

Dielectric

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

B = 5% min

lead

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std.

Product

Voltage

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

LD02 - 0402

C0G (NP0) = A Code (In pF)

LD03 - 0603

X7R = C

X5R = D

2 Sig. Digits +

Number of

Zeros

B = ±.10 pF (<10pF)

C = ±.25 pF (<10pF)

D = ±.50 pF (<10pF)

F = ±1% (≥ 10 pF)

G = ±2% (≥ 10 pF)

J = ±5%

LD04 - 0504

LD05 - 0805

LD06 - 1206

LD08 - 1808*

LD10 - 1210

Contact

Factory

For

LD12 - 1812

LD13 - 1825

Multiples

K = ±10%

LD14 - 2225

LD15 - 0204 LICC*

LD20 - 2220

LD16 - 0306 LICC

LD17 - 0508 LICC

LD18 - 0612 LICC

*Contact factory

ELECTRICAL GRAPHS

NPO

X7R

X7S

X5R

Y5V

Refer to page 4 for Electrical Graphs

Refer to page 12 for Electrical Graphs

Refer to page 16 for Electrical Graphs

Refer to page 19 for Electrical Graphs

Refer to page 23 for Electrical Graphs

26

MLCC Tin/Lead Termination “B”

Capacitance Range (NPO Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

MM

(in.)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

(W) Width

MM

(in.)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10

12

15

18

22

27

33

39

47

56

68

16

C

25

C

50

C

6.3

G

25

G

50

100

G

16

E

J

25

E

J

N

50

E

J

100

E

J

200

J

M

16

J

25

J

50

J

M

100

J

M

P

200

J

Cap

(pF)

G

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.10

J

M

Q

J

M

J

N

M

Cap

(µF)

W

L

ꢀ

T

ꢀ

t

WVDC

16

25

50

6.3

25

50

100

16

25

50

100

200

16

25

50

100

200

SIZE

0402

0603

0805

1206

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

PAPER

EMBOSSED

27

MLCC Tin/Lead Termination “B”

Capacitance Range (NPO Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD20

LD14

Soldering

Reflow/Wave

Reflow Only

Packaging

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

All Embossed

5.70 ± 0.40

(0.225 ± 0.016)

All Embossed

5.72 ± 0.25

(0.225 ± 0.010)

MM

(in.)

(L) Length

MM

(in.)

2.50 ± 0.20

(0.098 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

6.40 ± 0.40

(0.252 ± 0.016)

5.00 ± 0.40

(0.197 ± 0.016)

6.35 ± 0.25

(0.250 ± 0.010)

(W) Width

MM

(in.)

0.50 ± 0.25

(0.020 ± 0.010)

0.61 ± 0.36

(0.024 ± 0.014)

0.61 ± 0.36

(0.024 ± 0.014)

0.64 ± 0.39

(0.025 ± 0.015)

0.64 ± 0.39

(0.025 ± 0.015)

(t) Terminal

WVDC

0.5

1.0

25

50

100

200

25

50

100

200

50

100

200

50

100

200

50

100

200

Cap

(pF)

1.2

1.5

1.8

2.2

2.7

3.3

W

L

ꢀ

T

ꢀ

3.9

4.7

5.6

6.8

8.2

t

10

12

15

18

22

27

33

39

47

56

68

82

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

J

N

J

N

J

M

J

M

Q

K

M

K

M

P

K

M

X

K

P

M

P

M

X

P

Y

P

Y

Z

X

Cap

(µF)

P

0.068

0.082

0.10

P

WVDC

25

50

100

200

25

50

100

200

50

100

200

50

100

200

50

100

200

SIZE

1210

1812

1825

2220

2225

Letter

Max.

Thickness

A

0.33

(0.013)

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

Q

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.94

(0.037)

1.52

1.78

(0.070)

EMBOSSED

(0.060)

PAPER

28

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

MM

(in.)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

(W) Width

MM

(in.)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

100

120

150

180

220

270

330

390

470

560

680

820

6.3

C

10

C

16

C

25

C

50

C

6.3

10

16

25

50 100 200

10

16

25

50

100

200

10

16

25

50

100

200

Cap

(pF)

G

E

J

E

J

E

J

M

E

J

M

E

J

E

J

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.10

0.12

0.15

0.18

0.22

0.27

0.33

0.47

0.56

0.68

0.82

1.0

J

M

J

M

J

M

P

Cap

(µF)

J

M

J

M

N

M

J

M

Q

M

1.2

1.5

1.8

2.2

3.3

P

W

L

ꢀ

Q

T

ꢀ

4.7

10

22

47

t

100

WVDC

6.3

10

16

25

50

6.3

10

16

25

50 100 200

10

16

25

50

100

200

10

16

25

50

100

200

SIZE

0402

0603

0805

1206

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

X

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

1.78

(0.070)

2.29

(0.090)

PAPER

EMBOSSED

29

MLCC Tin/Lead Termination “B”

Capacitance Range (X7R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD10

LD12

LD13

LD14

Soldering

Packaging

Reflow/Wave

Paper/Embossed

Reflow Only Reflow Only Reflow Only

All Embossed All Embossed All Embossed

MM

(in.)

MM

(in.)

MM

(in.)

3.20 ± 0.20

(0.126 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

4.50 ± 0.30

(0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)

3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25

(0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)

0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39

(0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)

4.50 ± 0.30

5.72 ± 0.25

(L) Length

(W) Width

(t) Terminal

WVDC

10

16

25

50

100

50

100

50

100

50

100

Cap

(pF)

100

120

150

180

220

W

L

ꢀ

T

ꢀ

270

330

390

470

560

t

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.10

0.12

0.15

0.18

0.22

0.27

0.33

0.47

0.56

0.68

0.82

1.0

J

M

P

J

M

J

M

P

Cap

(µF)

K

M

K

M

P

M

N

M

N

Q

1.2

1.5

1.8

2.2

N

M

P

3.3

4.7

10

22

47

100

WVDC

10

16

25

50

100

50

100

50

100

50

100

SIZE

1210

1812

1825

2225

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

PAPER

EMBOSSED

30

MLCC Tin/Lead Termination “B”

Capacitance Range (X5R Dielectric)

PREFERRED SIZES ARE SHADED

SIZE

LD02

LD03

LD05

LD06

LD10

Soldering

Packaging

Reflow Only

All Paper

Reflow Only

All Paper

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

Reflow/Wave

Paper/Embossed

MM

(in.)

1.00 ± 0.10

(0.040 ± 0.004)

1.60 ± 0.15

(0.063 ± 0.006)

2.01 ± 0.20

(0.079 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

3.20 ± 0.20

(0.126 ± 0.008)

(L) Length

MM

(in.)

0.50 ± 0.10

(0.020 ± 0.004)

0.81 ± 0.15

(0.032 ± 0.006)

1.25 ± 0.20

(0.049 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

(W) Width

MM

(in.)

0.25 ± 0.15

(0.010 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

0.50 ± 0.25

(0.020 ± 0.010)

(t) Terminal

WVDC

6.3

10

6.3

25

10

16

10

16

25

16

Cap

(pF)

100

150

220

330

470

680

1000

W

L

ꢀ

T

ꢀ

t

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.056

0.068

0.082

0.10

0.12

0.15

0.18

0.22

0.27

0.33

0.47

0.56

0.68

0.82

1.0

Cap

(µF

C

G

C

G

N

G

N

M

Q

N

1.2

1.5

1.8

2.2

Q

3.3

4.7

Q

6.8

10

22

47

100

WVDC

6.3

10

6.3

25

10

16

SIZE

0402

0603

0805

1206

1210

Letter

Max.

Thickness

A

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

2.79

(0.110)

0.33

(0.013)

0.94

(0.037)

1.40

(0.055)

PAPER

EMBOSSED

31

Automotive MLCC

Automotive

GENERAL DESCRIPTION

AVX Corporation has supported the Automotive Industry requirements for

Multilayer Ceramic Capacitors consistently for more than 10 years. Products

have been developed and tested specifically for automotive applications and

all manufacturing facilities are QS9000 and VDA 6.4 approved.

As part of our sustained investment in capacity and state of the art

technology, we are now transitioning from the established Pd/Ag electrode

system to a Base Metal Electrode system (BME).

AVX is using AECQ200 as the qualification vehicle for this transition. A

detailed qualification package is available on request and contains results on

a range of part numbers including:

• X7R dielectric components containing BME electrode and copper

terminations with a Ni/Sn plated overcoat.

• X7R dielectric components BME electrode and soft terminations with a

Ni/Sn plated overcoat.

• NP0 dielectric components containing Pd/Ag electrode and silver termi-

nation with a Ni/Sn plated overcoat.

HOW TO ORDER

0805

5

C

104

K

4

2

A

T

Size

0603

0805

1206

1210

1812

Voltage Dielectric

Capacitance

Code (In pF)

2 Significant

Digits + Number

of Zeros

Capacitance

Tolerance

J = ±5%

K = ±10%

M = ±20%

Failure Rate

4 = Automotive

Packaging

2 = 7" Reel

4 = 13" Reel

Special Code

A = Std. Product

Terminations

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

NP0 = A

X7R = C

T = Plated Ni and Sn

Z = Soft Termination

U = Conductive Epoxy

e.g. 10µF = 106

COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON

Commercial

Automotive

Administrative

Design

Standard Part Numbers.

No restriction on who purchases these parts.

Specific Automotive Part Number. Used to control

supply of product to Automotive customers.

Minimum ceramic thickness of 0.020"

Side & End Margins = 0.003" min

As per EIA RS469

Minimum Ceramic thickness of 0.029" (0.74mm)

on all X7R product.

Dicing

Side & End Margins = 0.004" min

Cover Layers = 0.005" min

Lot Qualification

(Destructive Physical

Analysis - DPA)

Increased sample plan –

stricter criteria.

Visual/Cosmetic Quality

Application Robustness

Standard process and inspection

100% inspection

Standard sampling for accelerated

wave solder on X7R dielectrics

Increased sampling for accelerated wave solder on

X7R and NP0 followed by lot by lot reliability testing.

All Tests have Accept/Reject Criteria 0/1

32

Automotive MLCC

NP0/X7R Dielectric

SOFT TERMINATION FEATURES

a) Bend Test

b) Temperature Cycle testing

The capacitor is soldered to the PC Board as shown:

“Soft Termination” has the ability to withstand at least

1000 cycles between –55°C and +125°C

1mm/sec

90 mm

Typical bend test results are shown below:

Style

Conventional Term

Soft Term

0603

0805

1206

>2mm

>5

ELECTRODE AND TERMINATION OPTIONS

NP0 DIELECTRIC

NP0 Ag/Pd Electrode

Nickel Barrier Termination

PCB Application

Sn

Ni

Ag

Figure 1 Termination Code T

X7R DIELECTRIC

X7R Nickel Electrode

X7R Dielectric

Soft Termination

PCB Application

Ni

Cu

Sn

Ni

Epoxy

Ni

Cu

Sn

Figure 2 Termination Code T

Figure 3 Termination Code Z

Conductive Epoxy Termination

Hybrid Application

Ni

Cu

Termination

Conductive

Epoxy

Figure 4 Termination Code U

33

NP0 Automotive

Capacitance Range (Ni Barrier Termination)

0603

0805

1206

1210

1812

25V

G

50V

G

100V

G

25V

J

M

50V

J

100V

J

25V

J

50V

J

100V

J

M

Q

25V

50V

100V

200V

50V

100V

R47

R51

R56

R62

R68

R75

R82

R91

1R0

1R2

1R5

1R8

2R0

2R2

2R4

2R7

3R0

3R3

3R6

3R9

4R3

4R7

5R1

5R6

6R2

6R8

7R5

8R2

9R1

100

120

150

180

220

270

330

390

470

510

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

J

M

J

M

P

M

K

P

M

25V

M

25V

50V

100V

25V

50V

100V

50V

100V

50V

100V

200V

50V

100V

0603

0805

1206

1210

1812

Letter

Max.

Thickness

A

0.33

(0.013)

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

Y

2.54

(0.100)

Z

2.79

(0.110)

0.94

(0.037)

1.02

(0.040)

2.29

(0.090)

PAPER

EMBOSSED

34

BME X7R Automotive

Capacitance Range (Ni Barrier Termination)

0603

0805

1206

1210

1812

16V

25V

50V 100V 200V 16V

25V

50V 100V 200V

16V

25V

50V

100V 200V

16V

25V

50V

100V 200V 16V

25V

50V 100V 200V

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

155

G

J

N

J

M

J

M

K

M

P

J

M

K

M

P

K

M

P

K

M

P

K

M

X

K

M

X

K

M

X

J

M

N

M

P

M

P

16V

25V

50V 100V 200V 16V

25V

50V 100V 200V

16V

25V

50V

100V 200V

16V

25V

50V

100V 200V 16V

25V

50V 100V 200V

0603

0805

1206

1210

1812

Letter

Max.

Thickness

A

0.33

(0.013)

C

0.56

(0.022)

E

0.71

(0.028)

G

0.86

(0.034)

J

K

1.02

(0.040)

M

1.27

(0.050)

N

1.40

(0.055)

P

1.52

(0.060)

Q

1.78

(0.070)

X

2.29

(0.090)

Y

2.54

(0.100)

Z

0.94

(0.037)

2.79

(0.110)

PAPER

EMBOSSED

35

MLCC with Soft Termination

General Specifications

GENERAL DESCRIPTION

With increased requirements from the automotive industry for additional

component robustness, AVX recognized the need to produce a MLCC with

enhanced mechanical strength. It was noted that many components may be

subject to severe flexing and vibration when used in various under the

bonnet automotive applications.

To satisfy the requirement for enhanced mechanical strength, AVX had to

find a way of ensuring electrical integrity is maintained whilst external forces

are being applied to the component. It was found that the structure of the

termination needed to be flexible and after much research and development,

a “soft termination” was found. This soft termination is designed to enhance

the mechanical flexure and temperature cycling performance of a standard

ceramic capacitor with an X7R dielectric. The indus try s ta nda rd for

flexure is 2 mm minimum with Soft Termination. AVX guarantees a

minimum flexure of 5 mm, without any internal cracks. Beyond 5mm

g e ne ra lly the c o m p o ne nt will o p e n. The ind us try s ta nd a rd fo r

temperature cycling is 1000 cycles, AVX guarantees 3000 cycles.

APPLICATIONS

High Flexure Stress Circuit Boards

As well as for automotive applications the Soft Termination will provide

Design Engineers with a satisfactory solution when designing PCB’s which

may be subject to high levels of board flexure.

• e.g. Depanelization: Components near

edges of board.

PRODUCT ADVANTAGES

Variable Temperature Applications

• High mechanical performance able to withstand, 5mm bend test

guaranteed.

• Open failure mode is apparent when products are overstressed

by 5mm.

• Soft termination offers improved reliability

performance in applications where there is

temperature variation.

• e.g. All kind of engine s ens ors : Direct

connection to battery rail.

• Increased temperature cycling performance, 3000 cycles and beyond.

• Flexible termination system.

Automotive Applications

• Reduction in circuit board flex failures.

• Improved reliability.

• Base metal electrode system.

• Excellent mechanical performance and

thermo mechanical performance.

• Automotive or commercial grade products available.

HOW TO ORDER

0805

5

C

104

K

2

A

Z

Style

0603

0805

1206

1210

1812

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

2 = 200V

Dielectric

C = X7R

Capacitance

Code (In pF)

2 Sig Digits +

Number of Zeros

e.g., 104 = 100nF

Capacitance

Tolerance

J = ±5%

K = ±10%

M = ±20%

Packaging

2 = 7" reel

4 = 13" reel

Special Code

A = Std. Product

Failure

Rate

A=Commercial

4 = Automotive

Terminations

Z = Soft

Termination

36

MLCC with Soft Termination

Specifications and Test Methods

BOARD BEND TEST PROCEDURE

PERFORMANCE TESTING

According to AEC-Q200

AEC-Q200 Qualification:

• Created by the Automotive Electronics

Council

Test Procedure as per AEC-Q200:

Sample size:

Span: 90mm

20 components

LOADING

KNIFE

Minimum deflection spec: 2 mm

• Specification defining stress

test qualification for

passive components

•

Components soldered onto FR4 PCB (Figure 1)

MOUNTING

ASSEMBLY

Board connected electrically to the test equipment

(Figure 2)

DIGITAL

CALIPER

Testing:

BEND TESTPLATE

Key tests used to compare

soft termination to

AEC-Q200 qualification:

• Bend Test

CONNECTOR

CONTROL

PANEL

CONTROL PANEL

• Temperature Cycle Test

Fig 2 - Board Bend test

equipment

Fig 1 - PCB layout with electrical connections

BOARD BEND TEST RESULTS

AEC-Q200 Vrs AVX Soft Termination Bend Test

0603

0805

12

10

8

6

4

2

12

10

8

6

4

2

AVX ENHANCED SOFT

TERMINATION BEND TEST

PROCEDURE

0

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

Bend Test

The capacitor is soldered to the printed circuit

board as shown and is bent up to 10mm at

1mm per second:

1210

1206

12

10

8

12

10

8

6

4

2

0

6

4

2

0

Max. = 10mm

NPO

X7R

X7R soft term

NPO

X7R

X7R soft term

TABLE SUMMARY

90mm

Typical bend test results are shown below:

Style

0603

0805

1206

Conventional Termination

Soft Termination

>5mm

>2mm

• The board is placed on 2 supports 90mm

apart (capacitor side down)

• The row of capacitors is aligned with the

load stressing knife

>5mm

TEMPERATURE CYCLE TEST PROCEDURE

Test Procedure as per AEC-Q200:

Max. = 10mm

The test is conducted to determine the resistance of the

component when it is exposed to extremes of alternating

high and low temperatures.

• Sample lot size quantity 77 pieces

• TC chamber cycle from -55ºC to +125ºC for 1000 cycles

• Interim electrical measurements at 250, 500, 1000 cycles

• Measure parameter capacitance dissipation factor,

insulation resistance

• The load is applied and the deflection where

the part starts to crack is recorded (Note:

Equipment detects the start of the crack

using a highly sensitive current detection

circuit)

Test Temperature Profile (1 cycle)

+125⁰

+25⁰

C

• The maximum deflection capability is 10mm

-55⁰

C

1 hour 12mins

37

MLCC with Soft Termination

Specifications and Test Methods

BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS

0603

0805

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

1206

1210

10

8

10

8

6

4

2

0

500 1000 1500 2000 2500 3000

0

500 1000 1500 2000 2500 3000

AEC-Q200 specification states

1000 cycles compared to AVX

3000 temperature cycles.

Soft Term - No Defects up to 3000 cycles

SOFT TERMINATION TEST SUMMARY

• Qualified product by using the AEC-Q200 test/specifica-

tion with the exception of using AVX 3000 temperature

cycles (up to +150°C bend test guaranteed greater than

5mm).

• Board bend test improvement by a factor of 2 to 4 times.

• Temperature Cycling:

– 0% Failure up to 3000 cycles

– No ESR change up to 3000 cycles

• S oft Te rmina tion p rovid e s imp rove d p e rforma nc e

compared to standard termination systems.

WITHOUT SOFT TERMINATION

WITH SOFT TERMINATION

Major fear is of latent board flex failures.

Far superior mechanical performance.

Generally open failure mode beyond

5mm flexure.

38

MLCC with Soft Termination

X7R Dielectric Capacitance Range

0603

0805

1206

1210

1812

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

155

185

225

J

N

J

M

J

M

K

M

P

J

M

P

Q

K

M

P

K

M

P

K

M

P

K

M

X

K

M

X

K

M

X

K

M

X

J

M

N

M

Q

P

M

P

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

16V

25V

50V

100V

0603

0805

J

1206

1210

1812

Letter

Max.

Thickness

A

0.33

(0.013)

C

E

G

K

M

N

P

Q

X

Y

Z

0.56

(0.022)

0.71

(0.028)

0.86

(0.034)

0.94

(0.037)

1.02

(0.040)

1.27

(0.050)

1.40

(0.055)

1.52

(0.060)

1.78

(0.070)

2.29

(0.090)

2.54

(0.100)

2.79

(0.110)

PAPER

EMBOSSED

= Range extension parts

39

Capacitor Array

Capacitor Array (IPC)

BENEFITS OF USING CAPACITOR

ARRAYS

AVX capacitor arrays offer designers the opportunity to

lower placement costs, increase assembly line output

through lower component count per board and to reduce

real estate requirements.

For high volume users of cap arrays using the very latest

placement equipment capable of placing 10 components

per second, the increase in throughput can be very signifi-

cant and can have the overall effect of reducing the number

of placement machines required to mount components:

Reduced Costs

Placement costs are greatly reduced by effectively placing

one device instead of four or two. This results in increased

throughput and translates into savings on machine time.

Inventory levels are lowered and further savings are made

on solder materials, etc.

If 120 million 2-element arrays or 40 million 4-element arrays

were placed in a year, the requirement for placement

equipment would be reduced by one machine.

During a 20Hr operational day a machine places 720K

components. Over a working year of 167 days the machine

can place approximately 120 million. If 2-element arrays are

mounted instead of discrete components, then the number

of placements is reduced by a factor of two and in the

scenario where 120 million 2-element arrays are placed

there is a saving of one pick and place machine.

Space Saving

Space savings can be quite dramatic when compared to

the use of discrete chip capacitors. As an example, the

0508 4-element array offers a space reduction of >40% vs.

4 x 0402 discrete capacitors and of >70% vs. 4 x 0603

discrete capacitors. (This calculation is dependent on the

spacing of the discrete components.)

Smaller volume users can also benefit from replacing

discrete components with arrays. The total number of

placements is reduced thus creating spare capacity on

placement machines. This in turn generates the opportunity

to increase overall production output without further invest-

ment in new equipment.

Increased Throughput

Assuming that there are 220 passive components placed in

a mobile phone:

A reduction in the passive count to 200 (by replacing

discrete components with arrays) results in an increase in

throughput of approximately 9%.

A reduction of 40 placements increases throughput by 18%.

W2A (0508) Capacitor Arrays

4 pcs 0402 Capacitors

=

1 pc 0508 Array

1.88

(0.074)

1.4

1.0

(0.055) (0.039)

5.0 (0.197)

AREA = 7.0mm²(0.276 in²)

2.1 (0.083)

AREA = 3.95mm²(0.156 in²)

The 0508 4-element capacitor array gives a PCB space saving of over 40%

vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.

W3A (0612) Capacitor Arrays

4 pcs 0603 Capacitors

=

1 pc 0612 Array

2.0

(0.079)

2.3

(0.091)

1.5

(0.059)

6.0 (0.236)

AREA = 13.8mm²(0.543 in²)

3.2 (0.126)

AREA = 6.4mm²(0.252 in²)

The 0612 4-element capacitor array gives a PCB space saving of over 50%

vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.

40

Capacitor Array

NP0/C0G

X7R/X5R

SIZE

# Elements

Soldering

0405

2

0508

4

0612

4

SIZE

# Elements

Soldering

0405

2

0508

2

0508

4

0612

4

2

Reflow Only

Reflow/Wave

Reflow Only

Reflow/Wave

Packaging

All Paper

Paper/Embossed

Packaging

All Paper

Paper/Embossed

MM

1.00 ± 0.15

1.30 ± 0.15

(0.051 ± 0.006)

1.30 ± 0.15

(0.051 ± 0.006)

1.60 ± 0.150

(0.063 ± 0.006)

MM 1.00 ± 0.15

(in.) (0.039 ± 0.006)

1.30 ± 0.15

(0.051 ± 0.006)

1.30 ± 0.15

(0.051 ± 0.006)

1.60 ± 0.20

(0.063 ± 0.008)

Length

(in.) (0.039 ± 0.006)

MM 1.37 ± 0.15

(in.) (0.054 ± 0.006)

2.10 ± 0.15

(0.083 ± 0.006)

2.10 ± 0.15

(0.083 ± 0.006)

3.20 ± 0.20

(0.126 ± 0.008)

MM 1.37 ± 0.15

(in.) (0.054 ± 0.006)

2.10 ± 0.15

(0.083 ± 0.006)

2.10 ± 0.15

(0.083 ± 0.006)

3.20 ± 0.20

(0.126 ± 0.008)

Width

Max.

Width

Max.

MM

0.66

0.94

1.35

MM

0.66

0.94

1.35

Thickness (in.)

(0.026)

(0.037)

(0.053)

Thickness (in.)

(0.026)

(0.037)

(0.053)

WVDC

16

25

50

16

25

50 100

16

25

50 100

16 25 50 100

WVDC

10 16 25 50 10 16 25 50 100 16

25

50 100 16

25

50

100

Cap

(pF)

1.0

1.2

1.5

Cap

(pF)

100

120

150

1.8

2.2

2.7

180

220

270

3.3

3.9

4.7

330

390

470

5.6

6.8

8.2

560

680

820

10

12

15

1000

1200

1500

18

22

27

1800

2200

2700

33

39

47

3300

3900

4700

56

68

82

5600

6800

8200

100

120

150

Cap 0.010 µF

0.012

0.015

180

220

270

0.018

0.022

0.027

330

390

470

0.033

0.039

0.047

560

680

820

0.056

0.068

0.082

1000

1200

1500

0.10

0.12

0.15

1800

2200

2700

0.18

0.22

0.27

3300

3900

4700

0.33

0.47

0.56

5600

6800

8200

0.68

0.82

1.0

Cap 0.010

(µF)

1.2

1.5

1.8

2.2

3.3

4.7

10

22

47

100

= X5R

= X7R

= NP0/C0G

41

Capacitor Array

Multi-Value Capacitor Array (IPC)

GENERAL DESCRIPTION

A recent addition to the array product range is the Multi-

Value Capacitor Array. These devices combine two different

capacitance values in standard ‘Cap Array’ packages and

are available with a maximum ratio between the two capaci-

tance values of 100:1. The multi-value array is currently

available in the 0405 and 0508 2-element styles and also in

the 0612 4-element style.

ADVANTAGES OF THE MULTI-VALUE

CAPACITOR ARRAYS

Enhanced Performance Due to Reduced Parasitic

Inductance

When connected in parallel, not only do discrete capacitors

of different values give the desired self-resonance, but an

additional unwanted parallel resonance also results. This

parallel resonance is induced between each capacitor's

self-resonant frequencies and produces a peak in imped-

ance response. For decoupling and bypassing applications

this peak will result in a frequency band of reduced decou-

pling and in filtering applications reduced attenuation.

Whereas to date AVX capacitor arrays have been suited to

applications where multiple capacitors of the same value are

used, the multi-value array introduces a new flexibility to the

range. The multi-value array can replace discrete capacitors

of different values and can be used for broadband decou-

pling applications. The 0508 x 2 element multi-value array

would be particularly recommended in this application.

Another application is filtering the 900/1800 or 1900MHz

noise in mobile phones. The 0405 2-element, low capaci-

tance value NP0, (C0G) device would be suited to this

application, in view of the space saving requirements of

mobile phone manufacturers.

The multi-value capacitor array, combining capacitors in one

unit, virtually eliminates the problematic parallel resonance,

by minimizing parasitic inductance between the capacitors,

thus enhancing the broadband decoupling/filtering perfor-

mance of the part.

Reduced ESR

An advantage of connecting two capacitors in parallel is a

significant reduction in ESR. However, as stated above,

using discrete components brings with it the unwanted side

effect of parallel resonance. The multi-value cap array is

an excellent alternative as not only does it perform the

same function as parallel capacitors but also it reduces the

uncertainty of the frequency response.

HOW TO ORDER

W

2

A

2

Y

C

102M

104M

A

T

2A

1st Value

2nd Value

Style

Case

Size

1 = 0405

2 = 0508

3 = 0612

Array Number

of Caps

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

1 = 100V

Dielectric

A = NP0

C = X7R

D = X5R

Capacitance Capacitance Failure

Termination

Code

T = Plated Ni

and Sn

Packaging &

Quantity

Code (In pF)

2 Sig. Digits +

Number of

Zeros

Tolerance

K = ±10%

M = ±20%

Rate

Code

2A = 7" Reel (4000)

4A = 13" Reel (10000)

2F = 7" Reel (1000)

IMPEDANCE VS FREQUENCY

Cap (Min/Max)

1

0.8

0.6

0.4

0.2

NPO

X5R/X7R

221/104

101/103

2xDiscrete Caps (0603)

0612 4-element

0508 2-element

0405 2-element

100/471

100/101

• Max. ratio between the two cap values is 1:100.

Multi Value Cap (0508)

• The voltage of the higher capacitance value dictates

the voltage of the multi-value part.

0

1

• Only combinations of values within a specific dielectric

range are possible.

10

100

1000

Frequency (MHz)

42

Capacitor Array

PART & PAD LAYOUT DIMENSIONS

millimeters (inches)

0405 - 2 Element

PAD LAYOUT

0612 - 4 Element

PAD LAYOUT

W

E

X

P

D

S

P

S

A

B

T

C

C/L

OF CHIP

BW

C/L OF CHIP

C

L

C

L

BL

L

BL

L

0508 - 2 Element

PAD LAYOUT

0508 - 4 Element

PAD LAYOUT

E

W

P

D

W

D

S

X

A

S

P

A

B

C

T

C

BW

C/L OF CHIP

BW

C

L

C/L

OF CHIP

C

L

BL

L

BL

L

PART DIMENSIONS

0405 - 2 Element

PAD LAYOUT DIMENSIONS

0405 - 2 Element

L

W

1.37 ± 0.15

T

BW

0.36 ± 0.10

BL

0.20 ± 0.10

P

S

A

0.46

B

0.74

C

1.20

D

0.30

E

0.64

1.00 ± 0.15

0.66 MAX

0.64 REF

0.32 ± 0.10

(0.039 ± 0.006) (0.054 ± 0.006) (0.026 MAX) (0.014 ± 0.004) (0.008 ± 0.004

)

(0.025 REF) (0.013 ± 0.004)

(0.018)

(0.029)

(0.047)

(0.012)

(0.025)

0508 - 2 Element

L

W

2.10 ± 0.15

T

BW

0.43 ± 0.10

BL

0.33 ± 0.08

P

S

A

0.68

(0.027)

B

1.32

(0.052)

C

2.00

(0.079)

D

0.46

(0.018)

E

1.00

(0.039)

1.30 ± 0.15

0.94 MAX

1.00 REF

0.50 ± 0.10

(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.017 ± 0.004) (0.013 ± 0.003

(0.039 REF) (0.020 ± 0.004)

0508 - 4 Element

L

W

2.10 ± 0.15

T

BW

0.25 ± 0.06

BL

0.20 ± 0.08

P

X

S

A

0.56

(0.022)

B

1.32

(0.052)

C

1.88

(0.074)

D

0.30

(0.012)

E

0.50

(0.020)

1.30 ± 0.15

0.94 MAX

0.50 REF

0.75 ± 0.10

0.25 ± 0.10

(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.010 ± 0.003) (0.008 ± 0.003

(0.020 REF) (0.030 ± 0.004) (0.010 ± 0.004)

0612 - 4 Element

A

B

C

D

E

L

W

3.20 ± 0.20

T

BW

0.41 ± 0.10

BL

P

X

S

+0.25

0.89

1.65

2.54

0.46

0.79

1.60 ± 0.20

1.35 MAX

0.18

0.76 REF

1.14 ± 0.10

0.38 ± 0.10

-0.08

+0.010

(0.035)

(0.065)

(0.100)

(0.018)

(0.031)

(0.063 ± 0.008) (0.126 ± 0.008) (0.053 MAX) (0.016 ± 0.004) (0.007

)

(0.030 REF) (0.045 ± 0.004) (0.015 ± 0.004)

-0.003

43

Low Inductance Capacitors

Introduction

As switching speeds increase and pulse rise times decrease

INTERDIGITATED CAPACITORS

the need to reduce inductance becomes a serious limitation

for improved system performance. Even the decoupling

capacitors, that act as a local energy source, can generate

unacceptable voltage spikes: V = L (di/dt). Thus, in high

speed circuits, where di/dt can be quite large, the size of the

voltage spike can only be reduced by reducing L.

Multiple terminations of a capacitor will also help in reducing

the parasitic inductance of the device. The IDC is such a

device. By terminating one capacitor with 8 connections the

ESL can be reduced even further. The measured inductance

of the 0612 IDC is 60 pH, while the 0508 comes in around

50 pH. These FR4 mountable devices allow for even higher

clock speeds in a digital decoupling scheme. Design and

product offerings are shown on pages 48 and 49.

Figure 1 displays the evolution of ceramic capacitor toward

lower inductance designs over the last few years. AVX has

been at the forefront in the design and manufacture of these

newer more effective capacitors.

SpinGuard

2000

1500

1000

-

+

-

+

2000

pH

1206 MLC

pH

1200

0612 LICC

+

-

+

pH

170

500

0508 LICC

130pH

0306 LICC

0612

IDC

105pH

0508 IDC

60 pH

LICA

50 pH

25

LOW INDUCTANCE CHIP ARRAYS (LICA^®)

pH

Further reduction in inductance can be achieved by designing

alternative current paths to minimize the mutual inductance

factor of the electrodes (Figure 3). This is achieved by AVX’s

LICA^®product which was the result of a joint development

between AVX and IBM. As shown in Figure 4, the charging

current flowing out of the positive plate returns in the opposite

direction along adjacent negative plates. This minimizes the

mutual inductance.

0

1980s

1990s

Figure 1. The evolution of Low Inductance Capacitors at AVX

(values given for a 100 nF capacitor of each style)

LOW INDUCTANCE CHIP CAPACITORS

The total inductance of a chip capacitor is determined both

by its length to width ratio and by the mutual inductance

coupling between its electrodes. Thus a 1210 chip size has

lower inductance than a 1206 chip. This design improve-

ment is the basis of AVX’s low inductance chip capacitors, LI

Caps, where the electrodes are terminated on the long side

of the chip instead of the short side. The 1206 becomes an

0612 as demonstrated in Figure 2. In the same manner, an

0805 becomes an 0508 and 0603 becomes an 0306. This

results in a reduction in inductance from around 1200 pH

for conventional MLC chips to below 200 pH for Low

Inductance Chip Capacitors. Standard designs and perfor-

mance of these LI Caps are given on pages 46 and 47.

The very low inductance of the LICA capacitor stems from

the short aspect ratio of the electrodes, the arrangement of

the tabs so as to cancel inductance, and the vertical aspect

of the electrodes to the mounting surface.

Net

Inductance

Net

Inductance

1206

Figure 3. Net Inductance from design. In the

standard Multilayer capacitor, the charge currents

entering and leaving the capacitor create complementary

flux fields, so the net inductance is greater. On the right,

however, if the design permits the currents

0612

to be opposed, there is a net cancellation, and the

inductance is much lower.

Figure 2. Change in aspect ratio: 1206 vs. 0612

44

Low Inductance Capacitors

Introduction

Also the effective current path length is minimized because

the current does not have to travel the entire length of both

electrodes to complete the circuit. This reduces the self

inductance of the electrodes. The self inductance is also min-

imized by the fact that the charging current is supplied by

both sets of terminals reducing the path length even further!

The inductance of this arrangement is less than 30 pH,

causing the self-resonance to be above 100 MHz for the

same popular 100 nF capacitance. Parts available in the

LICA design are shown on pages 50 and 51.

Figure 5 compares the self resonant frequencies of various

capacitor designs versus capacitance values. The approxi-

mate inductance of each style is also shown.

Figure 4. LICA’s Electrode/Termination Construction.

The current path is minimized – this reduces self-inductance.

Current flowing out of the positive plate, returns in the

opposite direction along the adjacent negative plate –

this reduces the mutual inductance.

Active development continues on low inductance

capacitors. C4 termination with low temperature solder

is now available for plastic packages. Consult AVX

for details.

1000.00

100.00

LICA (25 pH)

0508 IDC (50 pH)

0612 IDC (60 pH)

0306 LICC (110 pH)

0508 LICC (130 pH)

0612 LICC (170 pH)

0603 (700 pH)

0805 (800 pH)

10.00

1206 (1200 pH)

1.00

10.00

100.00

1000.00

Capacitance, (nF)

Figure 5. Self Resonant Frequency vs. Capacitance and Capacitor Design

45

Low Inductance Capacitors

0612/0508/0306 LICC (Low Inductance Chip Capacitors)

GENERAL DESCRIPTION

The total inductance of a chip capacitor is determined both by its

length to width ratio and by the mutual inductance coupling

between its electrodes.

Thus a 1210 chip size has a lower inductance than a 1206 chip.

This design improvement is the basis of AVX’s Low Inductance

Chip Capacitors (LICC), where the electrodes are terminated on the

long side of the chip instead of the short side. The 1206 becomes

an 0612, in the same manner, an 0805 becomes an 0508, an 0603

becomes an 0306. This results in a reduction in inductance from

the 1nH range found in normal chip capacitors to less than 0.2nH

for LICCs. Their low profile is also ideal for surface mounting (both

LICC

MLCC

on the PCB and on IC package) or inside cavity mounting on the

IC itself.

HOW TO ORDER

0612

Z

D

105

M

A

T

2

A*

Size

0306

0508

0612

Voltage

6 = 6.3V

Z = 10V

Y = 16V

3 = 25V

5 = 50V

Dielectric

C = X7R

D = X5R

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

K = ±10%

Failure Rate Terminations

Packaging

Available

2 = 7" Reel

4 = 13" Reel

Thickness

mm (in)

0.56 (0.022)

0.61 (0.024)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

A = N/A

T = Plated Ni

and Sn

M = ±20%

J = Tin/Lead

TYPICAL INDUCTANCE

PERFORMANCE CHARACTERISTICS

Measured

Inductance (pH)

Capacitance Tolerances K = ±10%; M = ±20%

Package Style

Operation

Temperature Range

X7R = -55°C to +125°C;

X5R = -55°C to +85°C

1206 MLCC

0 6 1 2 LICC

0 5 0 8 LICC

1200

Temperature Coefficient ±15% (0VDC)

Voltage Ratings

6.3, 10, 16, 25 VDC

1 7 0

1 3 0

1 0 5

Dissipation Factor

6.3V = 6.5% max; 10V = 5.0% max;

16V = 3.5% max; 25V = 3.0% max

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

0 3 0 6 LICC

*Note: See Range Chart for Codes

TYPICAL IMPEDANCE CHARACTERISTICS

10

1

10

MLCC_0805

MLCC_1206

LICC_0612

1

0.1

LICC_0508

0.01

0.001

1

10

Frequency (MHz)

100

1000

1

10

100

1000

Frequency (MHz)

46

Low Inductance Capacitors

0612/0508/0306 LICC (Low Inductance Chip Capacitors)

SIZE

Packaging

0306

Embossed

0.81 ± 0.15

(0.032 ± 0.006)

0508

Embossed

1.27 ± 0.25

(0.050 ± 0.010)

0612

Embossed

1.60 ± 0.25

(0.063 ± 0.010)

PHYSICAL DIMENSIONS AND

PAD LAYOUT

MM

(in.)

Length

MM

(in.)

1.60 ± 0.15

(0.063 ± 0.006)

2.00 ± 0.25

(0.080 ± 0.010)

3.20 ± 0.25

(0.126 ± 0.010)

Width

WVDC

6.3 10 16 25 50 6.3 10 16 25 50 6.3 10 16 25 50

t

W

CAP

(uF)

0.001

0.0022

0.0047

0.010

0.015

0.022

0.047

0.068

0.10

0.15

0.22

0.47

0.68

1.0

T

L

PHYSICAL CHIP DIMENSIONS

mm (in)

L

W

t

1.60 ± 0.25

(0.063 ± 0.010)

3.20 ± 0.25

(0.126 ± 0.010)

0.13 min.

(0.005 min.)

0612

0508

0306

1.27 ± 0.25

(0.050 ± 0.010)

2.00 ± 0.25

(0.080 ± 0.010)

0.13 min.

(0.005 min.)

0.81 ± 0.15

(0.032 ± 0.006)

1.60 ± 0.15

(0.063 ± 0.006)

0.13 min.

(0.005 min.)

T - See Range Chart for Thickness and Codes

1.5

2.2

PAD LAYOUT DIMENSIONS

mm (in)

3.3

A

B

C

4.7

0612

0508

0306

0.76 (0.030)

0.51 (0.020)

0.31 (0.012)

3.05 (0.120)

2.03 (0.080)

1.52 (0.060)

.635 (0.025)

0.51 (0.020)

10

= X5R

Solid = X7R

mm (in.)

0306

0508

0612

Code Thickness

A

0.61 (0.024)

S

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

S

V

W

A

0.56 (0.022)

0.76 (0.030)

1.02 (0.040)

1.27 (0.050)

V

A

“B”

C

“A”

C

47

Low Inductance Capacitors

0612/0508 IDC (InterDigitated Capacitors)

GENERAL DESCRIPTION

• Very low equivalent series inductance (ESL), surface mountable,

high speed decoupling capacitor in 0612 and 0508 case size.

0612

• Measured inductances of 60 pH (for 0612) and 50 pH (for 0508)

are the lowest in the FR4 mountable device family. Now use 10T

devices with inductances of 45 pH (for 0612) and 35 pH (for

0508).

• Opposing current flow creates opposing magnetic fields. This

causes the fields to cancel, effectively reducing the equivalent

series inductance.

0508

+

–

+

–

• Perfect solution for decoupling high speed microprocessors by

allowing the engineers to lower the power delivery inductance of

the entire system through the use of eight vias.

• Overall reduction in decoupling components due to very low

series inductance and high capacitance.

+

–

+

HOW TO ORDER

225

M

W

3

L

1

6

D

A

T

3

A

Capacitance Capacitance

Code (In pF) Tolerance

Style

Case

Size

Low

Number

of

Terminals

1 = 8 Terminals

Voltage Dielectric

4 = 4V C = X7R

6 = 6.3V D = X5R

Z = 10V

Failure Termination Packaging

Thickness

Max. Thickness

mm (in.)

Inductance

Rate

T = Plated Ni Available

2 Sig. Digits +

Number of

Zeros

M = ±20%

A = N/A

2 = 0508 ESL = 50pH

3 = 0612 ESL = 60pH

and Sn

1=7" Reel

3=13" Reel A=0.95 (0.037)

S=0.55 (0.022)

Y = 16V

PERFORMANCE CHARACTERISTICS

Capacitance Tolerance

Operation

Temperature Range

±20% Preferred

X7R = -55°C to +125°C;

X5R = -55°C to +85°C

Dielectric Strength

CTE (ppm/C)

No problems observed after 2.5 x RVDC

for 5 seconds at 50mA max current

12.0

Temperature Coefficient ±15% (0VDC)

Thermal Conductivity 4-5W/M K

Voltage Ratings

4, 6.3, 10, 16 VDC

Terminations

Available

Dissipation Factor

4V, 6.3V = 6.5% max;

10V = 5.0% max;

16V = 3.5% max

Plated Nickel and Solder

Max. Thickness

0.037" (0.95mm)

Insulation Resistance

(@+25°C, RVDC)

100,000MΩ min, or 1,000MΩ per

µF min.,whichever is less

TYPICAL ESL AND IMPEDANCE

10

Measured

Package Style

Inductance (pH)

MLCC_1206

LICC_0612

1

1206 MLCC

0612 LICC

0 6 1 2 IDC

0 5 0 8 IDC

1200

170

6 0

0.1

IDC_0612

0.01

0.001

1

10

100

1000

5 0

Frequency (MHz)

48

Low Inductance Capacitors

0612/0508 IDC (InterDigitated Capacitors)

SIZE

Thin 0508

0508

Thin 0612

0612

MM

(in.)

2.03 ± 0.20

3.20 ± 0.20

Length

(0.080 ± 0.008)

(0.126 ± 0.008)

MM

(in.)

1.27 ± 0.20

(0.050 ± 0.008)

1.27 ± 0.20

(0.050 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

Width

Terminal

Pitch

MM

(in.)

0.508 REF

0.020 REF

0.508 REF

0.020 REF

0.76 REF

0.030 REF

0.76 REF

0.030 REF

MM

(in.)

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

0.55 MAX.

(0.022) MAX.

0.95 MAX.

(0.037) MAX.

Thickness

Inductance (pH)

WVDC

95

120

4

6.3

10

16

4

6.3

10

16

4

6.3

10

16

4

6.3

10

16

CAP (uF)

and Thickness

0.047

0.068

0.10

0.22

0.33

0.47

0.68

1.0

Consult factory for additional requirements

1.5

= X7R

= X5R

2.2

3.3

PHYSICAL DIMENSIONS AND PAD LAYOUT

L

X

S

P

T

E

D

BW

C/L OF CHIP

C

L

A

B

C

BL

W

PAD LAYOUT

DIMENSIONS

PHYSICAL CHIP DIMENSIONS millimeters (inches)

0612

L

W

BW

BL

P

X

S

A

B

C

D

E

+0.25

3.20 ± 0.20

1.60 ± 0.20

0.41 ± 0.10

0.18

0.76 REF

1.14 ± 0.10

0.38 ± 0.10

0.89

1.65

2.54

0.46

0.76

-0.08

+0.010

-0.003

(0.126 ± 0.008) (0.063 ± 0.008) (0.016 ± 0.004) (0.007

)

(0.030 REF) (0.045 ± 0.004) (0.015 ± 0.004)

(0.035) (0.065) (0.100) (0.018) (0.030)

0508

L

W

BW

BL

P

X

S

A

B

C

D

E

+0.25

-0.08

2.03±0.20

1.27±0.20

0.254±0.10

0.18

0.508 REF

0.76±0.10

0.254±0.10

0.64

1.27

1.91

0.28

0.51

(0.080±0.008) (0.050±0.008) (0.010±0.004) (0.007 ^+0.010

(0.020 REF) (0.030±0.004) (0.010±.0.004)

(0.025) (0.050) (0.075) (0.011) (0.020)

-0.003

49

Low Inductance Capacitors

LICA^®(Low Inductance Decoupling Capacitor Arrays)

LICA^®arrays utilize up to four separate capacitor sections in one

ceramic body (see Configurations and Capacitance Options). These

designs exhibit a number of technical advancements:

Low Inductance features–

Low resistance platinum electrodes in a low aspect ratio pattern

Double electrode pickup and perpendicular current paths

C4 “flip-chip” technology for minimal interconnect inductance

HOW TO ORDER

4

A

LICA

3

T

102

M

3

F

C

# of

Caps/Part

1 = one

2 = two B = Established B = No Bar

4 = four

Inspection

Code

A = Standard

Code

Face

A = Bar

Style Voltage Dielectric

Cap/Section Capacitance Height

(EIA Code) Tolerance Code

10V = Z T = T55T 102 = 1000 pF M = ±20% 6 = 0.500mm

Termination

F = C4 Solder

Reel Packaging

M = 7" Reel

&

5V = 9 D = X5R

Size

Balls- 97Pb/3Sn R = 13" Reel

P = GMV 3 = 0.650mm H = C4 Solder Balls 6 = 2"x2" Waffle Pack

25V = 3 S = High K 103 = 10 nF

T55T 104 = 100 nF

Reliability

Testing

C = Dot, S55S

Dielectrics

1 = 0.875mm

Low ESR

8 = 2"x2" Black Waffle

5 = 1.100mm P = Cr-Cu-Au

7 = 1.600mm N = Cr-Ni-Au

X = None

Pack

7 = 2"x2" Waffle Pack

w/ termination

facing up

TABLE 1

A = 2"x2" Black Waffle

Pack

w/ termination

facing up

C = 4"x4" Waffle Pack

w/ clear lid

Typical Parameters

Capacitance, 25°C

Capacitance, 55°C

Capacitance, 85°C

Dissipation Factor 25°

DC Resistance

T55T

Co

1.4 x Co

Co

12

0.2

Units

Nanofarads

Percent

Ohms

IR (Minimum @25°)

2.0

500

8.5

15 to 120

Megaohms

Volts

ppm/°C 25-100°

Pico-Henries

Dielectric Breakdown, Min

Thermal Coefficient of Expansion

Inductance: (Design Dependent)

Frequency of Operation

Ambient Temp Range

DC to 5 Gigahertz

-55° to 125°C

TERMINATION OPTIONS

C4 AND PAD DIMENSIONS

C4 SOLDER (97% Pb/3% Sn) BALLS

0.8 .03 (2 pics)

0.6 .100mm

“Centrality”*

}

0.925 0.03mm

L = .06mm

0.925 0.03mm

Vertical and

Horizontal

Pitch=0.4 .02mm

Code Face

to Denote

Orientation

(Optional)

C4 Ball diameter:

.164 .03mm

*NOTE: The C4 pattern

will be within

0.1mm of the

center of the

LICA body, in

both axes.

TERMINATION OPTION P OR N

"H " = (H +.096 .02mm typ)

t

b

"H

b

" .06

"W" = .06mm

Pin A1 is the lower left hand ball.

Code

(Body Height)

Width

(W)

Length

(L)

Height

Body (H_b)

1

3

5

6

7

1.600mm

1.850mm

0.875mm

0.650mm

1.100mm

0.500mm

1.600mm

50

Low Inductance Capacitors

LICA^®(Low Inductance Decoupling Capacitor Arrays)

LICA^®TYPICAL PERFORMANCE CURVES

10

160

LICA

Impedance

0V

5V

10V

25V

140

120

100

80

1.0

Resistance

60

.1

40

20

0

-60 -40

-20

0

20

40

140

60

80

100

120

.01

Temperature, °C

1

10

100

Frequency, MHz

Effect of Bias Voltage and

Temperature on a 130 nF LICA^®(T55T)

Impedance vs. Frequency

LICA VALID PART NUMBER LIST

CONFIGURATION

Schematic

Code Face

Capacitors per

Package

Part Number

Voltage Thickness (mm)

D

B

LICA3T193M3FC4AA

LICA3T153P3FC4AA

LICA3T134M1FC1AA

LICA3T104P1FC1AA

LICA3T333M1FC4AA

LICA3T263P3FC4AA

LICA3T244M5FC1AA

LICA3T194P5FC1AA

LICA3T394M7FC1AB

LICA3T314P7FC1AB

Extended Range

25

0.650

0.875

0.650

1.100

1.600

4

1

4

1

D

C

B

A

CAP

C

A

Schematic

Code Face

B1

B2

CAP 2

A2

D1

D2

D1 C1

D2 C2

B1

B2

A1

A2

CAP 1

A1

C1

C2

LICAZT623M3FC4AB

LICA3T104M3FC1A

LICA3T803P3FC1A

LICA3T503M3FC2A

LICA3T403P3FC2A

LICA3S253M3FC4A

10

25

0.650

4

1

2

4

Schematic

Code Face

B1

B2

D1

D2

D1 C1

D2 C2

D3 C3

D4 C4

B1

B2

B3

B4

A1

A2

A3

A4

CAP 1

CAP 2

A1

B3

A2

B4

C1

D3

C2

D4

CAP 3

A3

CAP 4

A4

C3

C4

WAFFLE PACK OPTIONS FOR LICA^®

LICA^®PACKAGING SCHEME “M” AND “R”

8mm conductive plastic tape on reel:

“M”=7" reel max. qty. 3,000, “R”=13" reel max. qty. 8,000

FLUOROWARE®

Code Face

to Denote

Orientation

Code Face

to Denote

Orientation

®

Wells for LICA part, C4 side down

76 pieces/foot

1.75mm x 2.01mm x 1.27mm deep

on 4mm centers

0.64mm Push Holes

H20-080

Option "6"

Option "C"

100 pcs.

per 2" x 2"

package

Code Face

to Denote

Orientation

(Typical)

400 pcs. per

1.75mm

4" x 4" package

Note: Standard configuration is

Termination side down

Sprocket Holes: 1.55mm, 4mm pitch

51

High Voltage MLC Chips

For 600V to 5000V Application

High value, low leakage and small size are difficult parameters to obtain

in capacitors for high voltage systems. AVX special high voltage MLC

chips capacitors meet these performance characteristics and are

designed for applications such as snubbers in high frequency power

converters, resonators in SMPS, and high voltage coupling/DC blocking.

These high voltage chip designs exhibit low ESRs at high frequencies.

Larger physical sizes than normally encountered chips are used to make

high voltage chips. These larger sizes require that special precautions be

taken in applying these chips in surface mount assemblies. This is due

to differences in the coefficient of thermal expansion (CTE) between the

substrate materials and chip capacitors. Apply heat at less than 4°C per

second during the preheat. The preheat temperature must be within

50°C of the peak temperature reached by the ceramic bodies through

the soldering process. Chips 1808 and larger to use reflow soldering

only.

Capacitors with X7R Dielectrics are not intended for AC line filtering

applications. Contact plant for recommendations.

Capacitors may require protective surface coating to prevent external

arcing.

HOW TO ORDER

1808

A

271

K

A

1

A

AVX

Style

Voltage Temperature Capacitance Code

Capacitance

Tolerance

C0G: J = ±5% A = Standard T = NiGuard

K = ±10%

M = ±20%

X7R: K = ±10%

M = ±20%

Test

Level

Termination*

1 = Pd/Ag

Packaging

1 = 7" Reel

3 = 13" Reel

9 = Bulk

Special

Code

A = Standard

600V = C Coefficient

(2 significant digits

+ no. of zeros)

Examples:

1206 1000V = A

1210 1500V = S

1808 2000V = G

1812 2500V = W

1825 3000V = H

2220 4000V = J

C0G = A

X7R = C

Nickel

10 pF = 100

Barrier

Solderable

Plate

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF =105

Z = +80%, -20%

2225

3640

5000V = K

W

L

T

t

DIMENSIONS

millimeters (inches)

SIZE

1206

1210

1808*

1812*

4.50 ± 0.3

1825*

2220*

2225*

3640*

(L) Length

3.20 ± 0.2

4.57 ± 0.25

4.50 ± 0.3

5.7 ± 0.4

5.72 ± 0.25

9.14 ± 0.25

(0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

1.60 ± 0.2 2.50 ± 0.2 2.03 ± 0.25 3.20 ± 0.2 6.40 ± 0.3 5.0 ± 0.4 6.35 ± 0.25 10.2 ± 0.25

(0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(W) Width

(T) Thickness

Max.

1.52

(0.060)

1.70

(0.067)

2.03

(0.080)

2.54

(0.100)

2.54

(0.100)

3.3

(0.130)

2.54

(0.100)

2.54

(0.100)

(t) terminal

min.

max.

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

0.75 (0.030)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.25 (0.010)

1.02 (0.040)

0.76 (0.030)

1.52 (0.060)

*Reflow Soldering Only

52

High Voltage MLC Chips

For 600V to 5000V Applications

C0G Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.047 µF

(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)

Capacitance Tolerances

±5%, ±10%, ±20%

Dissipation Factor

0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)

-55°C to +125°C

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

0 ±30 ppm/°C (0 VDC)

600, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

120% rated voltage for 5 seconds at 50 mA max. current

Insulation Resistance (+25°C, at 500 VDC)

Insulation Resistance (+125°C, at 500 VDC)

Dielectric Strength

HIGH VOLTAGE C0G CAPACITANCE VALUES

VOLTAGE

1206

10 pF

1210

1808

1812

1825

2220

2225

3640

min.

100 pF

1500 pF

10 pF

820 pF

10 pF

330 pF

10 pF

150 pF

—

100 pF

2700 pF

100 pF

1500 pF

10 pF

470 pF

10 pF

270 pF

10 pF

150 pF

10 pF

100 pF

10 pF

39 pF

—

100 pF

5600 pF

100 pF

2700 pF

10 pF

1000 pF

0.012 µF

100 pF

6800 pF

100 pF

2700 pF

100 pF

1800 pF

10 pF

1000 pF

0.012 µF

1000 pF

0.010 µF

100 pF

2700 pF

100 pF

2200 pF

100 pF

1000 pF

10 pF

1000 pF

0.015 µF

1000 pF

0.010 µF

100 pF

3300 pF

100 pF

2200 pF

100 pF

1200 pF

10 pF

1000 pF

0.047 µF

1000 pF

0.018 µF

100 pF

600

max.

680 pF

10 pF

470 pF

10 pF

150 pF

10 pF

68 pF

—

min.

1000

max.

min.

1500

max.

1000 pF

10 pF

8200 pF

100 pF

min.

2000

max.

680 pF

10 pF

5600 pF

100 pF

min.

2500

max.

—

390 pF

10 pF

1000 pF

10 pF

3900 pF

100 pF

min.

—

3000

max.

—

330 pF

10 pF

680 pF

10 pF

680 pF

10 pF

820 pF

10 pF

2200 pF

100 pF

min.

—

4000

max.

—

100 pF

—

220 pF

—

220 pF

—

330 pF

—

1000 pF

10 pF

min.

—

5000

max.

—

680 pF

X7R Dielectric

Performance Characteristics

Capacitance Range

10 pF to 0.56 µF (25°C, 1.0 ±0.2 Vrms at 1kHz)

±10%; ±20%; +80%, -20%

2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)

-55°C to +125°C

Capacitance Tolerances

Dissipation Factor

Operating Temperature Range

Temperature Characteristic

Voltage Ratings

±15% (0 VDC)

600, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)

100K MΩ min. or 1000 MΩ - µF min., whichever is less

10K MΩ min. or 100 MΩ - µF min., whichever is less

120% rated voltage for 5 seconds at 50 mA max. current

Insulation Resistance (+25°C, at 500 VDC)

Insulation Resistance (+125°C, at 500 VDC)

Dielectric Strength

HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE

1206

1210

1808

1812

1825

2220

2225

3640

min.

1000 pF

0.015 µF

100 pF

5600 pF

100 pF

1800 pF

10 pF

1000pF

—

1000 pF

0.033 µF

1000 pF

0.015 µF

100 pF

3900 pF

100 pF

2200 pF

—

1000 pF

0.056 µF

1000 pF

0.018 µF

100 pF

6800 pF

100 pF

2700 pF

10 pF

1000 pF

0.10 µF

1000 pF

0.027 µF

100 pF

0.012 µF

100 pF

4700 pF

10 pF

0.01 µF

0.18 µF

1000 pF

0.10 µF

1000 pF

0.033 µF

100 pF

0.01 µF

100 pF

6800 pF

100 pF

4700 pF

—

0.01 µF

0.22 µF

1000 pF

0.10 µF

1000 pF

0.039 µF

1000 pF

0.01 µF

100 pF

8200 pF

100 pF

4700 pF

—

0.01 µF

0.22 µF

1000 pF

0.10 µF

1000 pF

0.047 µF

1000 pF

0.015 µF

100 pF

0.01 µF

100 pF

6800 pF

—

0.01 µF

0.56 µF

0.01 µF

0.22 µF

1000 pF

0.068 µF

1000 pF

0.027 µF

1000 pF

0.022 µF

1000 pF

0.018 µF

100 pF

600

max.

min.

1000

max.

min.

1500

max.

min.

2000

max.

min.

2500

max.

—

1800 pF

10 pF

3300 pF

10 pF

min.

—

3000

max.

—

1500 pF

—

2200 pF

—

min.

—

4000

max.

—

6800 pF

100 pF

min.

—

5000

max.

—

3300 pF

53

MIL-PRF-55681/Chips

Part Number Example

CDR01 thru CDR06

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

CDR01 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,

CDR06

Termination Finish:

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coated*

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

Voltage Temperature Limits:

BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = ±15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

*Solder shall have a melting point of 200°C or less.

Failure Rate Level: M = 1.0%, P = .1%, R = .01%,

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

S = .001%

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Rated Voltage: A = 50V, B = 100V

Capacitance Tolerance: J ± 5%, K ± 10%, M ± 20%

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Thickness (T)

D

Termination Band (t)

Per

AVX

Length (L)

Width (W)

MIL-PRF-55681 Style

Max.

Min.

.020

Max.

—

Min.

.030

—

Max.

—

Min.

.010

CDR01

CDR02

CDR03

CDR04

0805 .080 ± .015 .050 ± .015 .055

1805 .180 ± .015 .050 ± .015 .055

1808 .180 ± .015 .080 ± .018 .080

1812 .180 ± .015 .125 ± .015 .080

—

.030

—

+.020

-.015

+.020

-.015

CDR05

1825 .180

.250

.080

.020

—

.030

.010

CDR06

2225 .225 ± .020 .250 ± .020 .080

*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

54

MIL-PRF-55681/Chips

Military Part Number Identification

CDR01 thru CDR06

CDR01 thru CDR06 to MIL-PRF-55681

Military

Type

Rated temperature WVDC

Military

Type

Rated temperature WVDC

and voltage-

Capacitance Capacitance

and voltage-

Capacitance Capacitance

Designation

in pF

tolerance

temperature limits

Designation

in pF

tolerance

temperature limits

AVX Style 0805/CDR01

AVX Style 1808/CDR03

CDR01BP100B---

CDR01BP120B---

CDR01BP150B---

CDR01BP180B---

CDR01BP220B---

10

12

15

18

22

J,K

J

J,K

J

BP

100

CDR03BP331B---

CDR03BP391B---

CDR03BP471B---

CDR03BP561B---

CDR03BP681B---

330

390

470

560

680

J,K

J

J,K

J

BP

100

J,K

CDR01BP270B---

CDR01BP330B---

CDR01BP390B---

CDR01BP470B---

CDR01BP560B---

27

33

39

47

56

J

J,K

J

J,K

J

BP

100

CDR03BP821B--

CDR03BP102B---

CDR03BX123B--

CDR03BX153B---

CDR03BX183B---

820

1000

12,000

15,000

18,000

J

J,K

K

K,M

K

BP

BX

100

CDR01BP680B---

CDR01BP820B---

CDR01BP101B---

CDR01B--121B---

CDR01B--151B---

68

82

100

120

150

J,K

J

J,K

BP

BP,BX

100

CDR03BX223B---

CDR03BX273B---

CDR03BX333B---

CDR03BX393A---

CDR03BX473A---

22,000

27,000

33,000

39,000

47,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR01B--181B---

CDR01BX221B---

CDR01BX271B---

CDR01BX331B---

CDR01BX391B---

180

220

270

330

390

J,K

K,M

K

K,M

K

BP,BX

BX

100

CDR03BX563A---

CDR03BX683A---

56,000

68,000

K

K,M

BX

50

AVX Style 1812/CDR04

CDR04BP122B---

CDR04BP152B---

CDR04BP182B---

CDR04BP222B---

CDR04BP272B---

1200

1500

1800

2200

2700

J

J,K

J

J,K

J

BP

100

CDR01BX471B---

CDR01BX561B---

CDR01BX681B---

CDR01BX821B---

CDR01BX102B---

470

560

680

820

1000

K,M

K

K,M

K

BX

100

K,M

CDR04BP332B---

CDR04BX393B---

CDR04BX473B---

CDR04BX563B---

CDR04BX823A---

3300

J,K

K

K,M

K

BP

100

50

CDR01BX122B---

CDR01BX152B---

CDR01BX182B---

CDR01BX222B---

CDR01BX272B---

1200

1500

1800

2200

2700

K

K,M

K

K,M

K

BX

100

39,000

47,000

56,000

82,000

BX

K

CDR04BX104A---

CDR04BX124A---

CDR04BX154A---

CDR04BX184A---

100,000

120,000

150,000

180,000

K,M

K

K,M

K

BX

50

CDR01BX332B---

CDR01BX392A---

CDR01BX472A---

3300

3900

4700

K,M

K

K,M

BX

100

50

AVX Style 1805/CDR02

AVX Style 1825/CDR05

CDR02BP221B---

CDR02BP271B---

CDR02BX392B---

CDR02BX472B---

CDR02BX562B---

220

270

3900

4700

5600

J,K

J

K

K,M

K

BP

BX

100

CDR05BP392B---

CDR05BP472B---

CDR05BP562B---

CDR05BX683B---

CDR05BX823B---

3900

4700

5600

68,000

82,000

J,K

K,M

K

BP

BX

100

CDR02BX682B---

CDR02BX822B---

CDR02BX103B---

CDR02BX123A---

CDR02BX153A---

6800

8200

10,000

12,000

15,000

K,M

K

K,M

K

BX

100

50

CDR05BX104B---

CDR05BX124B---

CDR05BX154B---

CDR05BX224A---

CDR05BX274A---

100,000

120,000

150,000

220,000

270,000

K,M

K

K,M

K

BX

100

50

K,M

50

CDR02BX183A---

CDR02BX223A---

18,000

22,000

K

K,M

BX

50

CDR05BX334A---

330,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

AVX Style 2225/CDR06

CDR06BP682B---

CDR06BP822B---

CDR06BP103B---

CDR06BX394A---

CDR06BX474A---

6800

8200

10,000

390,000

470,000

J,K

K

BP

BX

100

50

K,M

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

55

MIL-PRF-55681/Chips

Part Number Example

CDR31 thru CDR35

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

(example) CDR31 BP 101

B

K

S

M

L

W

D

t

MIL Style

Voltage-temperature

Limits

Capacitance

T

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35

Termination Finish:

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coated*

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

Voltage Temperature Limits:

BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = ±15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

*Solder shall have a melting point of 200°C or less.

Capacitance: Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Failure Rate Level: M = 1.0%, P = .1%, R = .01%,

S = .001%

Rated Voltage: A = 50V, B = 100V

Packaging: Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

Capacitance Tolerance: C ± .25 pF, D ± .5 pF, F ± 1%

J ± 5%, K ± 10%, M ± 20%

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35

Thickness (T)

D

Termination Band (t)

Per MIL-PRF-55681

(Metric Sizes)

AVX

Style

Length (L) Width (W)

(mm)

Max. (mm)

Min. (mm) Max. (mm) Min. (mm)

CDR31

CDR32

CDR33

CDR34

CDR35

0805

1206

1210

1812

1825

2.00

3.20

4.50

1.25

1.60

2.50

3.20

6.40

1.3

1.5

.50

—

.70

.30

56

MIL-PRF-55681/Chips

Military Part Number Identification CDR31

CDR31 to MIL-PRF-55681/7

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 0805/CDR31 (BP)

AVX Style 0805/CDR31 (BP) cont’d

CDR31BP1R0B---

CDR31BP1R1B---

CDR31BP1R2B---

CDR31BP1R3B---

CDR31BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR31BP101B---

CDR31BP111B---

CDR31BP121B---

CDR31BP131B---

CDR31BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR31BP1R6B---

CDR31BP1R8B---

CDR31BP2R0B---

CDR31BP2R2B---

CDR31BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR31BP161B---

CDR31BP181B---

CDR31BP201B---

CDR31BP221B---

CDR31BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR31BP2R7B---

CDR31BP3R0B---

CDR31BP3R3B---

CDR31BP3R6B---

CDR31BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR31BP271B---

CDR31BP301B---

CDR31BP331B---

CDR31BP361B---

CDR31BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR31BP4R3B---

CDR31BP4R7B---

CDR31BP5R1B---

CDR31BP5R6B---

CDR31BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR31BP431B---

CDR31BP471B---

CDR31BP511A---

CDR31BP561A---

CDR31BP621A---

430

470

510

560

620

F,J,K

BP

100

50

CDR31BP6R8B---

CDR31BP7R5B---

CDR31BP8R2B---

CDR31BP9R1B---

CDR31BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR31BP681A---

680

F,J,K

BP

50

AVX Style 0805/CDR31 (BX)

CDR31BX471B---

CDR31BX561B---

CDR31BX681B---

CDR31BX821B---

CDR31BX102B---

470

560

680

820

1,000

K,M

BX

100

CDR31BP110B---

CDR31BP120B---

CDR31BP130B---

CDR31BP150B---

CDR31BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR31BX122B---

CDR31BX152B---

CDR31BX182B---

CDR31BX222B---

CDR31BX272B---

1,200

1,500

1,800

2,200

2,700

K,M

BX

100

CDR31BP180B---

CDR31BP200B---

CDR31BP220B---

CDR31BP240B---

CDR31BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR31BX332B---

CDR31BX392B---

CDR31BX472B---

CDR31BX562A---

CDR31BX682A---

3,300

3,900

4,700

5,600

6,800

K,M

BX

100

50

CDR31BP300B---

CDR31BP330B---

CDR31BP360B---

CDR31BP390B---

CDR31BP430B---

30

33

36

39

43

F,J,K

BP

100

50

CDR31BX822A---

CDR31BX103A---

CDR31BX123A---

CDR31BX153A---

CDR31BX183A---

8,200

10,000

12,000

15,000

18,000

K,M

BX

50

CDR31BP470B---

CDR31BP510B---

CDR31BP560B---

CDR31BP620B---

CDR31BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR31BP750B---

CDR31BP820B---

CDR31BP910B---

75

82

91

F,J,K

BP

100

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1 / The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

57

MIL-PRF-55681/Chips

Military Part Number Identification CDR32

CDR32 to MIL-PRF-55681/8

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1206/CDR32 (BP)

AVX Style 1206/CDR32 (BP) cont’d

CDR32BP1R0B---

CDR32BP1R1B---

CDR32BP1R2B---

CDR32BP1R3B---

CDR32BP1R5B---

1.0

1.1

1.2

1.3

1.5

B,C

BP

100

CDR32BP101B---

CDR32BP111B---

CDR32BP121B---

CDR32BP131B---

CDR32BP151B---

100

110

120

130

150

F,J,K

BP

100

CDR32BP1R6B---

CDR32BP1R8B---

CDR32BP2R0B---

CDR32BP2R2B---

CDR32BP2R4B---

1.6

1.8

2.0

2.2

2.4

B,C

BP

100

CDR32BP161B---

CDR32BP181B---

CDR32BP201B---

CDR32BP221B---

CDR32BP241B---

160

180

200

220

240

F,J,K

BP

100

CDR32BP2R7B---

CDR32BP3R0B---

CDR32BP3R3B---

CDR32BP3R6B---

CDR32BP3R9B---

2.7

3.0

3.3

3.6

3.9

B,C,D

BP

100

CDR32BP271B---

CDR32BP301B---

CDR32BP331B---

CDR32BP361B---

CDR32BP391B---

270

300

330

360

390

F,J,K

BP

100

CDR32BP4R3B---

CDR32BP4R7B---

CDR32BP5R1B---

CDR32BP5R6B---

CDR32BP6R2B---

4.3

4.7

5.1

5.6

6.2

B,C,D

BP

100

CDR32BP431B---

CDR32BP471B---

CDR32BP511B---

CDR32BP561B---

CDR32BP621B---

430

470

510

560

620

F,J,K

BP

100

CDR32BP6R8B---

CDR32BP7R5B---

CDR32BP8R2B---

CDR32BP9R1B---

CDR32BP100B---

6.8

7.5

8.2

9.1

10

B,C,D

F,J,K

BP

100

CDR32BP681B---

CDR32BP751B---

CDR32BP821B---

CDR32BP911B---

CDR32BP102B---

680

750

820

910

1,000

F,J,K

BP

100

CDR32BP110B---

CDR32BP120B---

CDR32BP130B---

CDR32BP150B---

CDR32BP160B---

11

12

13

15

16

F,J,K

BP

100

CDR32BP112A---

CDR32BP122A---

CDR32BP132A---

CDR32BP152A---

CDR32BP162A---

1,100

1,200

1,300

1,500

1,600

F,J,K

BP

50

CDR32BP180B---

CDR32BP200B---

CDR32BP220B---

CDR32BP240B---

CDR32BP270B---

18

20

22

24

27

F,J,K

BP

100

CDR32BP182A---

CDR32BP202A---

CDR32BP222A---

1,800

2,000

2,200

F,J,K

BP

50

AVX Style 1206/CDR32 (BX)

CDR32BP300B---

CDR32BP330B---

CDR32BP360B---

CDR32BP390B---

CDR32BP430B---

30

33

36

39

43

F,J,K

BP

100

CDR32BX472B---

CDR32BX562B---

CDR32BX682B---

CDR32BX822B---

CDR32BX103B---

4,700

5,600

6,800

8,200

10,000

K,M

BX

100

CDR32BP470B---

CDR32BP510B---

CDR32BP560B---

CDR32BP620B---

CDR32BP680B---

47

51

56

62

68

F,J,K

BP

100

CDR32BX123B---

CDR32BX153B---

CDR32BX183A---

CDR32BX223A---

CDR32BX273A---

12,000

15,000

18,000

22,000

27,000

K,M

BX

100

50

CDR32BP750B---

CDR32BP820B---

CDR32BP910B---

75

82

91

F,J,K

BP

100

CDR32BX333A---

CDR32BX393A---

33,000

39,000

K,M

BX

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1 / The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

58

MIL-PRF-55681/Chips

Military Part Number Identification CDR33/34/35

CDR33/34/35 to MIL-PRF-55681/9/10/11

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Military

Type

Designation 1 /

Rated temperature WVDC

and voltage-

temperature limits

Capacitance Capacitance

in pF tolerance

Capacitance Capacitance

in pF tolerance

AVX Style 1210/CDR33 (BP)

AVX Style 1812/CDR34 (BX)

CDR33BP102B---

CDR33BP112B---

CDR33BP122B---

CDR33BP132B---

CDR33BP152B---

1,000

1,100

1,200

1,300

1,500

F,J,K

BP

100

CDR34BX273B---

CDR34BX333B---

CDR34BX393B---

CDR34BX473B---

CDR34BX563B---

27,000

33,000

39,000

47,000

56,000

K,M

BX

100

CDR33BP162B---

CDR33BP182B---

CDR33BP202B---

CDR33BP222B---

CDR33BP242A---

1,600

1,800

2,000

2,200

2,400

F,J,K

BP

100

50

CDR34BX104A---

CDR34BX124A---

CDR34BX154A---

CDR34BX184A---

100,000

120,000

150,000

180,000

K,M

BX

50

CDR33BP272A---

CDR33BP302A---

CDR33BP332A---

2,700

3,000

3,300

F,J,K

BP

50

AVX Style 1825/CDR35 (BP)

CDR35BP472B---

CDR35BP512B---

CDR35BP562B---

CDR35BP622B---

CDR35BP682B---

4,700

5,100

5,600

6,200

6,800

F,J,K

BP

100

AVX Style 1210/CDR33 (BX)

CDR33BX153B---

CDR33BX183B---

CDR33BX223B---

CDR33BX273B---

CDR33BX393A---

15,000

18,000

22,000

27,000

39,000

K,M

BX

100

50

CDR35BP752B---

CDR35BP822B---

CDR35BP912B---

CDR35BP103B---

CDR35BP113A---

7,500

8,200

9,100

10,000

11,000

F,J,K

BP

100

50

CDR33BX473A---

CDR33BX563A---

CDR33BX683A---

CDR33BX823A---

CDR33BX104A---

47,000

56,000

68,000

82,000

100,000

K,M

BX

50

CDR35BP123A---

CDR35BP133A---

CDR35BP153A---

CDR35BP163A---

CDR35BP183A---

12,000

13,000

15,000

16,000

18,000

F,J,K

BP

50

AVX Style 1812/CDR34 (BP)

CDR35BP203A---

CDR35BP223A---

20,000

22,000

F,J,K

BP

50

CDR34BP222B---

CDR34BP242B---

CDR34BP272B---

CDR34BP302B---

CDR34BP332B---

2,200

2,400

2,700

3,000

3,300

F,J,K

BP

100

AVX Style 1825/CDR35 (BX)

CDR35BX563B---

CDR35BX683B---

CDR35BX823B---

CDR35BX104B---

CDR35BX124B---

56,000

68,000

82,000

100,000

120,000

K,M

BX

100

CDR34BP362B---

CDR34BP392B---

CDR34BP432B---

CDR34BP472B---

CDR34BP512A---

3,600

3,900

4,300

4,700

5,100

F,J,K

BP

100

50

CDR35BX154B---

CDR35BX184A---

CDR35BX224A---

CDR35BX274A---

CDR35BX334A---

150,000

180,000

220,000

270,000

330,000

K,M

BX

100

50

CDR34BP562A---

CDR34BP622A---

CDR34BP682A---

CDR34BP752A---

CDR34BP822A---

5,600

6,200

6,800

7,500

8,200

F,J,K

BP

50

CDR35BX394A---

CDR35BX474A---

390,000

470,000

K,M

BX

50

CDR34BP912A---

CDR34BP103A---

9,100

10,000

F,J,K

BP

50

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

Add appropriate failure rate

Add appropriate termination finish

Capacitance Tolerance

1 / The complete part number will include additional symbols to indicate capacitance

tolerance, termination and failure rate level.

59

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm

12mm

Paper or Embossed Carrier

Embossed Only

0612, 0508, 0805, 1206,

1210

1812, 1825

2220, 2225

1808

Paper Only

0201, 0306, 0402, 0603

Qty. per Reel/7" Reel

2,000, 3,000 or 4,000, 10,000, 15,000

Contact factory for exact quantity

3,000

500, 1,000

Contact factory for exact quantity

Qty. per Reel/13" Reel

5,000, 10,000, 50,000

10,000

4,000

Contact factory for exact quantity

REEL DIMENSIONS

Tape

A

Max.

B*

Min.

D*

Min.

N

Min.

W₂

Max.

C

W₁

W₃

Size⁽¹⁾

7.90 Min.

(0.311)

+1.5

14.4

8.40 ^-0.0

8mm

(0.331 -⁺0⁰.^.0⁰⁵⁹

)

(0.567)

10.9 Max.

(0.429)

330

(12.992)

1.5

(0.059)

13.0 -⁺0⁰.^.2⁵0⁰

20.2

(0.795)

50.0

(1.969)

(0.512 ⁺^-0⁰^.^.⁰⁰⁰²⁸⁰

)

11.9 Min.

(0.469)

15.4 Max.

(0.607)

+2.0

18.4

(0.724)

12.4 -0.0

12mm

(0.488 ⁺^-0⁰^.^.⁰⁰⁷⁹

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

60

Embossed Carrier Configuration

8 & 12mm Tape Only

10 PITCHES CUMULATIVE

TOLERANCE ON TAPE

0.2mm ( 0.008)

EMBOSSMENT

P₀

T₂

T

D₀

P₂

DEFORMATION

BETWEEN

EMBOSSMENTS

Chip Orientation

E₁

A₀

W

F

E₂

TOP COVER

TAPE

B₁

B₀

P₁

K₀

T₁

D₁FOR COMPONENTS

2.00 mm x 1.20 mm AND

LARGER (0.079 x 0.047)

CENTER LINES

OF CAVITY

S₁

MAX. CAVITY

SIZE - SEE NOTE 1

B₁IS FOR TAPE READER REFERENCE ONLY

INCLUDING DRAFT CONCENTRIC AROUND B₀

User Direction of Feed

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

S₁Min.

T Max.

T₁

+0.10

8mm

and

12mm

1.50 -0.0

1.75 ± 0.10

4.0 ± 0.10

2.0 ± 0.05

0.60

(0.024)

0.60

(0.024)

0.10

(0.004)

Max.

(0.059 ⁺^-0⁰^.^.⁰⁰⁰⁴

)

(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)

VARIABLE DIMENSIONS

Tape Size

B₁

Max.

D₁

Min.

E₂

Min.

F

P₁

R

T₂

W

Max.

A₀B₀K₀

Min.

See Note 5 See Note 2

4.35

(0.171)

1.00

6.25

3.50 ± 0.05

4.00 ± 0.10

25.0

(0.984)

2.50 Max.

(0.098)

8.30

(0.327)

8mm

See Note 1

(0.039) (0.246) (0.138 ± 0.002) (0.157 ± 0.004)

8.20

(0.323)

1.50

10.25

5.50 ± 0.05

4.00 ± 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

12mm

(0.059) (0.404) (0.217 ± 0.002) (0.157 ± 0.004)

8mm

1/2 Pitch

4.35

(0.171)

1.00

6.25

3.50 ± 0.05

2.00 ± 0.10

25.0

(0.984)

2.50 Max.

(0.098)

8.30

(0.327)

(0.039) (0.246) (0.138 ± 0.002) (0.079 ± 0.004)

12mm

Double

Pitch

8.20

(0.323)

1.50

10.25

5.50 ± 0.05

8.00 ± 0.10

30.0

(1.181)

6.50 Max.

(0.256)

12.3

(0.484)

(0.059) (0.404) (0.217 ± 0.002) (0.315 ± 0.004)

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A , B₀, and K shall be configured to provide the following:

Surround the component with sufficient clearance such that:

0

3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.

Refer to EIA-556.

a) the component does not protrude beyond the sealing plane of the cover tape.

b) the component can be removed from the cavity in a vertical direction without mechanical

restriction, after the cover tape has been removed.

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

c) rotation of the component is limited to 20º maximum (see Sketches D & E).

d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).

Top View, Sketch "F"

Component Lateral Movements

0.50mm (0.020)

Maximum

0.50mm (0.020)

Maximum

61

Paper Carrier Configuration

8 & 12mm Tape Only

10 PITCHES CUMULATIVE

TOLERANCE ON TAPE

0.20mm ( 0.008)

P₀

D₀

P₂

T

E₁

BOTTOM

COVER

TAPE

TOP

COVER

TAPE

F

W

E₂

B₀

G

T₁

A₀

P₁

CAVITY SIZE

SEE NOTE 1

T₁

CENTER LINES

OF CAVITY

User Direction of Feed

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size

D₀

E

P₀

P₂

T₁

G. Min.

R Min.

+0.10

1.50 ^-0.0

8mm

and

12mm

1.75 ± 0.10

4.00 ± 0.10

2.00 ± 0.05

0.10

(0.004)

Max.

0.75

(0.030)

Min.

25.0 (0.984)

See Note 2

Min.

(0.059 -⁺0⁰.^.0⁰⁰⁴

)

(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)

VARIABLE DIMENSIONS

P¹

Tape Size

E₂Min.

F

W

A₀B₀

See Note 1

T

See Note 4

+0.30

8mm

4.00 ± 0.10

(0.157 ± 0.004)

6.25

(0.246)

3.50 ± 0.05

(0.138 ± 0.002)

8.00 -0.10

(0.315 ⁺^-0⁰^.^.⁰⁰⁰¹⁴²

)

1.10mm

(0.043) Max.

for Paper Base

Tape and

4.00 ± 0.010

(0.157 ± 0.004)

10.25

(0.404)

5.50 ± 0.05

(0.217 ± 0.002) (0.472 ± 0.012)

12.0 ± 0.30

12mm

1.60mm

(0.063) Max.

for Non-Paper

Base Compositions

+0.30

8mm

1/2 Pitch

2.00 ± 0.05

(0.079 ± 0.002)

6.25

(0.246)

3.50 ± 0.05

(0.138 ± 0.002)

8.00 ^-0.10

(0.315 ⁺-0⁰.^.0⁰0¹4²

)

12mm

Double

Pitch

8.00 ± 0.10

(0.315 ± 0.004)

10.25

(0.404)

5.50 ± 0.05

(0.217 ± 0.002) (0.472 ± 0.012)

12.0 ± 0.30

NOTES:

2. Tape with or without components shall pass around radius “R” without damage.

1. The cavity defined by A , B₀, and T shall be configured to provide sufficient clearance

surrounding the component so that:

0

3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket

holes. Refer to EIA-556.

a) the component does not protrude beyond either surface of the carrier tape;

b) the component can be removed from the cavity in a vertical direction without

mechanical restriction after the top cover tape has been removed;

c) rotation of the component is limited to 20º maximum (see Sketches A & B);

d) lateral movement of the component is restricted to 0.5mm maximum

(see Sketch C).

4. If P₁= 2.0mm, the tape may not properly index in all tape feeders.

Top View, Sketch "C"

Component Lateral

0.50mm (0.020)

Maximum

0.50mm (0.020)

Maximum

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556

62

Bulk Case Packaging

BENEFITS

BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

Case

Cassette

• Recyclable

Gate

Shooter

CASE DIMENSIONS

Shutter

Slider

12mm

36mm

Mounter

Head

Expanded Drawing

110mm

Chips

Attachment Base

CASE QUANTITIES

Part Size

0402

0603

0805

1206

Qty.

(pcs / cassette)

10,000 (T=.023")

8,000 (T=.031")

6,000 (T=.043")

5,000 (T=.023")

4,000 (T=.032")

3,000 (T=.044")

80,000

15,000

63

Basic Capacitor Formulas

I. Capacitance (farads)

XI. Equivalent Series Resistance (ohms)

.224 K A

E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)

English: C =

T_D

XII. Power Loss (watts)

.0884 K A

2

Metric: C =

Power Loss = (2 π fCV ) (D.F.)

T_D

XIII. KVA (Kilowatts)

II. Energy stored in capacitors (J oules, watt - sec)

-3

2

KVA = 2 π fCV x 10

2

1

E = ⁄ CV

2

XIV. Temperature Characteristic (ppm/°C)

III. Linear charge of a capacitor (Amperes)

Ct – C₂₅

dV

T.C. =

x 10⁶

I = C

C₂₅(T_t– 25)

dt

XV. Cap Drift (% )

C₁– C₂

C₁

IV. Total Impedance of a capacitor (ohms)

2

_{Z =}ꢀ

C.D. =

x 100

R_S+ (X - X )

C

L

V. Capacitive Reactance (ohms)

XVI. Reliability of Ceramic Capacitors

1

x =

c

L₀

V

X

T_t

T_o

Y

t

=

2 π fC

(_V) ( )

L

o

t

VI. Inductive Reactance (ohms)

XVII. Capacitors in Series (current the same)

x_L= 2 π fL

Any Number:

1

C

1

C₂

1

---

=

+

VII. Phase Angles:

C₁

C

N

T

Ideal Capacitors: Current leads voltage 90°

Ideal Inductors: Current lags voltage 90°

Ideal Resistors: Current in phase with voltage

C₁C₂

C₁+ C₂

Two: C

=

T

XVIII. Capacitors in Parallel (voltage the same)

= C₁+ C₂--- + C

VIII. Dissipation Factor (% )

C

T

N

E.S.R.

D.F.= tan ꢃ (loss angle) =

= (2 πfC) (E.S.R.)

X

XIX. Aging Rate

c

IX. Power Factor (% )

^{A.R. = %}D ^{C/decade of time}

P.F. = Sine ꢃ (loss angle) = Cos (phase angle)

P.F. = (when less than 10%) = DF

f

XX. Decibels

V

1

db = 20 log

X. Quality Factor (dimensionless)

V

2

1

D.F.

Q = Cotan ꢃ (loss angle) =

METRIC PREFIXES

SYMBOLS

X 10^-12

X 10^-9

X 10^-6

X 10^-3

X 10^-1

X 10⁺¹

X 10⁺³

X 10⁺⁶

X 10⁺⁹

X 10⁺¹²

t

K

A

T_D

V

t

= Dielectric Constant

f

= frequency

= Inductance

= Loss angle

= Phase angle

L

= Test life

Pico

Nano

Micro

Milli

= Area

L

ꢃ

V

= Test voltage

t

= Dielectric thickness

= Voltage

V

= Operating voltage

= Test temperature

= Operating temperature

o

Deci

Deca

Kilo

T

t

f

Mega

Giga

Tera

= time

X & Y = exponent effect of voltage and temp.

T_o

R

s

= Series Resistance

L_o

= Operating life

64

General Description

Basic Construction – A multilayer ceramic (MLC) capaci-

tor is a monolithic block of ceramic containing two sets of

offset, interleaved planar electrodes that extend to two

opposite surfaces of the ceramic dielectric. This simple

structure requires a considerable amount of sophistication,

both in material and manufacture, to produce it in the quality

and quantities needed in today’s electronic equipment.

Electrode

Ceramic Layer

End Terminations

Terminated

Edge

Terminated

Edge

Margin

Electrodes

Multilayer Ceramic Capacitor

Figure 1

Formulations – Multilayer ceramic capacitors are available

in both Class 1 and Class 2 formulations. Temperature

compensating formulation are Class 1 and temperature

stable and general application formulations are classified

as Class 2.

Class 2 – EIA Class 2 capacitors typically are based on the

chemistry of barium titanate and provide a wide range of

capacitance values and temperature stability. The most

commonly used Class 2 dielectrics are X7R and Y5V. The

X7R provides intermediate capacitance values which vary

only ±15% over the temperature range of -55°C to 125°C. It

finds applications where stability over a wide temperature

range is required.

Class 1 – Class 1 capacitors or temperature compensating

capacitors are usually made from mixtures of titanates

where barium titanate is normally not a major part of the

mix. They have predictable temperature coefficients and

in general, do not have an aging characteristic. Thus they

are the most stable capacitor available. The most popular

Class 1 multilayer ceramic capacitors are C0G (NP0)

temperature compensating capacitors (negative-positive

0 ppm/°C).

The Y5V provides the highest capacitance values and is

used in applications where limited temperature changes are

expected. The capacitance value for Y5V can vary from

22% to -82% over the -30°C to 85°C temperature range.

All Class 2 capacitors vary in capacitance value under the

influence of temperature, operating voltage (both AC and

DC), and frequency. For additional information on perfor-

mance changes with operating conditions, consult AVX’s

software, SpiCap.

65

General Description

Effects of Voltage – Variations in voltage have little effect

on Class 1 dielectric but does affect the capacitance and

dissipation factor of Class 2 dielectrics. The application of

DC voltage reduces both the capacitance and dissipation

factor while the application of an AC voltage within a

reasonable range tends to increase both capacitance and

dissipation factor readings. If a high enough AC voltage is

applied, eventually it will reduce capacitance just as a DC

voltage will. Figure 2 shows the effects of AC voltage.

Table 1: EIA and MIL Temperature Stable and General

Application Codes

EIA CODE

Percent Capacity Change Over Temperature Range

RS198

Temperature Range

X7

X6

X5

Y5

Z5

-55°C to +125°C

-55°C to +105°C

-55°C to +85°C

-30°C to +85°C

+10°C to +85°C

Cap. Change vs. A.C. Volts

X7R

Code

Percent Capacity Change

50

40

30

20

D

E

F

P

R

S

±3.3%

±4.7%

±7.5%

±10%

±15%

±22%

10

0

T

U

V

+22% , -33%

+22% , - 56%

+22% , -82%

12.5

25

37.5

50

EXAMPLE – A capacitor is desired with the capacitance value at 25°C

to increase no more than 7.5% or decrease no more than 7.5% from

-30°C to +85°C. EIA Code will be Y5F.

Volts AC at 1.0 KHz

Figure 2

Capacitor specifications specify the AC voltage at which to

measure (normally 0.5 or 1 VAC) and application of the

wrong voltage can cause spurious readings. Figure 3 gives

the voltage coefficient of dissipation factor for various AC

voltages at 1 kilohertz. Applications of different frequencies

will affect the percentage changes versus voltages.

MIL CODE

Symbol

Temperature Range

A

B

C

-55°C to +85°C

-55°C to +125°C

-55°C to +150°C

D.F. vs. A.C. Measurement Volts

X7R

Cap. Change

Zero Volts

Cap. Change

Rated Volts

Symbol

10.0

Curve 1 - 100 VDC Rated Capacitor

Curve 2 - 50 VDC Rated Capacitor

Curve 3 - 25 VDC Rated Capacitor

Curve 3

Curve 2

R

S

W

X

Y

Z

+15% , -15%

+22% , -22%

+22% , -56%

+15% , -15%

+30% , -70%

+20% , -20%

+15% , -40%

+22% , -56%

+22% , -66%

+15% , -25%

+30% , -80%

+20% , -30%

8.0

6.0

4.0

Curve 1

2.0

0

Temperature characteris tic is s pecified by combining range and

change symbols, for example BR or AW. Specification slash sheets

indicate the characteristic applicable to a given style of capacitor.

.5

1.0

1.5

2.0

2.5

AC Measurement Volts at 1.0 KHz

In specifying capacitance change with temperature for Class

2 materials, EIA expresses the capacitance change over an

operating temperature range by a 3 symbol code. The first

symbol represents the cold temperature end of the temper-

ature range, the second represents the upper limit of the

operating temperature range and the third symbol repre-

s e nts the c a p a c ita nc e c ha nge a llowe d ove r the

operating temperature range. Table 1 provides a detailed

explanation of the EIA system.

Figure 3

Typical effect of the application of DC voltage is shown in

Figure 4. The voltage coefficient is more pronounced for

higher K dielectrics. These figures are shown for room tem-

perature conditions. The combination characteristic known

as voltage temperature limits which shows the effects of

rated voltage over the operating temperature range is

shown in Figure 5 for the military BX characteristic.

66

General Description

tends to de-age capacitors and is why re-reading of capaci-

tance after 12 or 24 hours is allowed in military specifica-

tions after dielectric strength tests have been performed.

Typical Cap. Change vs. D.C. Volts

X7R

2.5

0

Typical Curve of Aging Rate

X7R

+1.5

0

-2.5

-5

-7.5

-10

-1.5

25%

50%

75%

100%

-3.0

-4.5

Percent Rated Volts

Figure 4

Typical Cap. Change vs. Temperature

X7R

-6.0

-7.5

+20

+10

0

1

10

100 1000 10,000 100,000

Hours

0VDC

Characteristic Max. Aging Rate %/Decade

None

2

7

C0G (NP0)

X7R, X5R

Y5V

-10

-20

-30

Figure 6

Effe c ts of Fre que nc y – Frequency affects capacitance

and impedance characteristics of capacitors. This effect is

much more pronounced in high dielectric constant ceramic

formulation than in low K formulations. AVX’s SpiCap soft-

ware generates impedance, ESR, series inductance, series

resonant frequency and capacitance all as functions of

frequency, temperature and DC bias for standard chip sizes

and styles. It is available free from AVX and can be down-

loaded for free from AVX website: www.avx.com.

-55 -35 -15 +5 +25 +45 +65 +85 +105 +125

Temperature Degrees Centigrade

Figure 5

Effe c ts of Tim e – Class 2 ceramic capacitors change

capacitance and dissipation factor with time as well as tem-

perature, voltage and frequency. This change with time is

known as aging. Aging is caused by a gradual re-alignment

of the crystalline structure of the ceramic and produces an

exponential loss in capacitance and decrease in dissipation

factor versus time. A typical curve of aging rate for semi-

stable ceramics is shown in Figure 6.

If a Class 2 ceramic capacitor that has been sitting on the

shelf for a period of time, is heated above its curie point,

1

(125°C for 4 hours or 150°C for ⁄

2

hour will suffice) the part

will de-age and return to its initial capacitance and dissi-

pation factor readings. Because the capacitance changes

rapidly, immediately after de-aging, the basic capacitance

measurements are normally referred to a time period some-

time after the de-aging process. Various manufacturers use

different time bases but the most popular one is one day

or twenty-four hours after “last heat.” Change in the aging

curve can be caused by the application of voltage and

other stresses. The possible changes in capacitance due to

de-aging by heating the unit explain why capacitance

changes are allowed after test, such as temperature cycling,

moisture resistance, etc., in MIL specs. The application of

high voltages such as dielectric withstanding voltages also

67

General Description

Effe c ts o f Me c ha nic a l Stre s s – High “K” dielectric

ceramic capacitors exhibit some low level piezoelectric

reactions under mechanical stress. As a general statement,

the piezoelectric output is higher, the higher the dielectric

constant of the ceramic. It is desirable to investigate this

effect before using high “K” dielectrics as coupling capaci-

tors in extremely low level applications.

Energy Stored – The energy which can be stored in a

capacitor is given by the formula:

2

E = ¹⁄

2

CV

E = energy in joules (watts-sec)

V = applied voltage

C = capacitance in farads

Reliability – Historically ceramic capacitors have been one

of the most reliable types of capacitors in use today.

The approximate formula for the reliability of a ceramic

capacitor is:

Potential Change – A capacitor is a reactive component

which reacts against a change in potential across it. This is

shown by the equation for the linear charge of a capacitor:

L_o

L_t

V

X

T_t

Y

t

=

ꢁ ꢁ

ꢁ_Vꢁ

T

o

dV

dt

I_ideal

=

C

where

L_o= operating life

L_t= test life

T_t= test temperature and

T_o= operating temperature

in °C

where

I = Current

C = Capacitance

V = test voltage

t

V_o= operating voltage

X,Y = see text

dV/dt = Slope of voltage transition across capacitor

Thus an infinite current would be required to instantly

change the potential across a capacitor. The amount of

current a capacitor can “sink” is determined by the above

equation.

Historically for ceramic capacitors exponent X has been

considered as 3. The exponent Y for temperature effects

typically tends to run about 8.

Equivalent Circuit – A capacitor, as a practical device,

exhibits not only capacitance but also resistance and

inductance. A simplified schematic for the equivalent circuit

is:

A capacitor is a component which is capable of storing

electrical energy. It consists of two conductive plates (elec-

trodes) separated by insulating material which is called the

dielectric. A typical formula for determining capacitance is:

C = Capacitance

L = Inductance

R_s= Series Resistance

R_p= Parallel Resistance

.224 KA

C =

t

R _P

C = capacitance (picofarads)

K = dielectric constant (Vacuum = 1)

A = area in square inches

t = separation between the plates in inches

(thickness of dielectric)

L

R _S

.224 = conversion constant

C

(.0884 for metric system in cm)

Reactance – Since the insulation resistance (R_p) is normal-

Capacitance – The standard unit of capacitance is the

farad. A capacitor has a capacitance of 1 farad when 1

coulomb charges it to 1 volt. One farad is a very large unit

and most capacitors have values in the micro (10^-6), nano

(10^-9) or pico (10^-12) farad level.

ly very high, the total impedance of a capacitor is:

2

Z = R²_S+ (X - X )

C

L

ꢀ

where

Z = Total Impedance

Dielectric Constant – In the formula for capacitance given

above the dielectric constant of a vacuum is arbitrarily cho-

sen as the number 1. Dielectric constants of other materials

are then compared to the dielectric constant of a vacuum.

R_s= Series Resistance

X_C= Capacitive Reactance =

1

2 π fC

X_L= Inductive Reactance = 2 π fL

Dielectric Thickness – Capacitance is indirectly propor-

tional to the separation between electrodes. Lower voltage

requirements mean thinner dielectrics and greater capaci-

tance per volume.

The variation of a capacitor’s impedance with frequency

determines its effectiveness in many applications.

Phas e Angle – Power Factor and Dissipation Factor are

often confused since they are both measures of the loss in

a capacitor under AC application and are often almost

identical in value. In a “perfect” capacitor the current in the

capacitor will lead the voltage by 90°.

Area – Capacitance is directly proportional to the area of

the electrodes. Since the other variables in the equation are

usually set by the performance desired, area is the easiest

parameter to modify to obtain a specific capacitance within

a material group.

68

General Description

di

dt

The

seen in current microprocessors can be as high as

I (Ideal)

0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic

inductance can cause a voltage spike of 30mV. While this

does not sound very drastic, with the Vcc for microproces-

sors decreasing at the current rate, this can be a fairly large

percentage.

I (Actual)

Loss

Angle

Phase

Angle

ꢃ

Another important, often overlooked, reason for knowing

the parasitic inductance is the calculation of the resonant

frequency. This can be important for high frequency, by-

pass capacitors, as the resonant point will give the most

signal attenuation. The resonant frequency is calculated

from the simple equation:

f

V

IR_s

In practice the current leads the voltage by some other

phase angle due to the series resistance R_S. The comple-

ment of this angle is called the loss angle and:

f^res=

1

_2ꢄꢀ_LC

Ins ula tio n Re s is ta nc e – Insulation Resistance is the

resistance measured across the terminals of a capacitor

and consists principally of the parallel resistance R^Pshown

in the equivalent circuit. As capacitance values and hence

the area of dielectric increases, the I.R. decreases and

hence the product (C x IR or RC) is often specified in ohm

faradsor more commonly megohm-microfarads. Leakage

current is determined by dividing the rated voltage by IR

(Ohm’s Law).

^{Power Factor (P.F.) = Cos}f ^{or Sine ꢃ}

Dissipation Factor (D.F.) = tan ꢃ

for small values of ꢃ the tan and sine are essentially equal

which has led to the common interchangeability of the two

terms in the industry.

Eq uiva le nt Se rie s Re s is ta nc e – The term E.S.R. or

Equivalent Series Resistance combines all losses both

series and parallel in a capacitor at a given frequency so

that the equivalent circuit is reduced to a simple R-C series

connection.

Dielectric Strength – Dielectric Strength is an expression

of the ability of a material to withstand an electrical stress.

Although dielectric strength is ordinarily expressed in volts, it

is actually dependent on the thickness of the dielectric and

thus is also more generically a function of volts/mil.

Dielectric Abs orption – A capacitor does not discharge

instantaneously upon application of a short circuit, but

drains gradually after the capacitance proper has been dis-

charged. It is common practice to measure the dielectric

absorption by determining the “reappearing voltage” which

appears across a capacitor at some point in time after it has

been fully discharged under short circuit conditions.

E.S.R.

C

Dissipation Factor – The DF/PF of a capacitor tells what

percent of the apparent power input will turn to heat in the

capacitor.

Corona – Corona is the ionization of air or other vapors

which causes them to conduct current. It is especially

prevalent in high voltage units but can occur with low voltages

as well where high voltage gradients occur. The energy

discharged degrades the performance of the capacitor and

can in time cause catastrophic failures.

E.S.R.

X_C

Dissipation Factor =

= (2 π fC) (E.S.R.)

The watts loss are:

2

Watts loss = (2 π fCV ) (D.F.)

Very low values of dissipation factor are expressed as their

reciprocal for convenience. These are called the “Q” or

Quality factor of capacitors.

Parasitic Inductance – The parasitic inductance of capac-

itors is becoming more and more important in the decou-

pling of today’s high speed digital systems. The relationship

between the inductance and the ripple voltage induced on

the DC voltage line can be seen from the simple inductance

equation:

di

dt

V = L

69

Surface Mounting Guide

MLC Chip Capacitors

REFLOW SOLDERING

Case Size

0402

D1

D2

D3

D4

D5

D2

1.70 (0.07)

2.30 (0.09)

3.00 (0.12)

4.00 (0.16)

5.60 (0.22)

6.60 (0.26)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

1.00 (0.04))

1.00 (0.04)

0.50 (0.02)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

3.60 (0.14)

4.60 (0.18)

0.60 (0.02)

0.80 (0.03)

1.00 (0.04)

0.50 (0.02)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

2.00 (0.08)

3.00 (0.12)

6.35 (0.25)

5.00 (0.20)

6.35 (0.25)

0603

0805

1206

1210

1808

1812

1825

2220

D1

D3

D4

D5

2225

Dimensions in millimeters (inches)

Component Pad Design

Component pads should be designed to achieve good

solder filets and minimize component movement during

reflow soldering. Pad designs are given below for the most

common sizes of multilayer ceramic capacitors for both

wave and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

WAVE SOLDERING

D2

Case Size

0603

D1

D2

D3

D4

D5

D1

D3

D4

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

0805

1206

Dimensions in millimeters (inches)

D5

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

Cleaning

≥1.5mm (0.06)

≥1mm (0.04)

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

≥1mm (0.04)

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

70

Surface Mounting Guide

MLC Chip Capacitors

Wave

APPLICATION NOTES

300

Storage

Preheat

Natural

Cooling

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

250

200

150

100

50

T

Solderability

230°C

to

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.

250°C

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Solder

Tin/Lead/Silver Temp. °C

60/40/0 260 ± 5

Solder

Immersion Time

Seconds

0

Termination Type

1 to 2 min

3 sec. max

Nickel Barrier

30 ± 1

(Preheat chips before soldering)

T/maximum 150°C

Recommended Soldering Profiles

Lead-Free Wave Soldering

The recommended peak temperature for lead-free wave

soldering is 250°C-260°C for 3-5 seconds. The other para-

meters of the profile remains the same as above.

Reflow

300

Natural

Cooling

Preheat

The following should be noted by customers changing from

lead based systems to the new lead free pastes.

250

200

a) The visual standards used for evaluation of solder joints

will need to be modified as lead free joints are not as

bright as with tin-lead pastes and the fillet may not be as

large.

220°C

to

250°C

150

100

50

b) Resin color may darken slightly due to the increase in

temperature required for the new pastes.

c) Lead-free solder pastes do not allow the same self align-

ment as lead containing systems. Standard mounting

pads are acceptable, but machine set up may need to be

modified.

0

1min

(Minimize soldering time)

10 sec. max

1min

General

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Lead-Free Reflow Profile

300

250

200

150

100

Handling

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

50

0

50

100

150

200

250

300

Time (s)

• Pre-heating: 150°C 15°C / 60-90s

• Max. Peak Gradient 2.5°C/s

• Peak Temperature: 245°C 5°C

• Time at >230°C: 40s Max.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

71

Surface Mounting Guide

MLC Chip Capacitors

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

POST SOLDER HANDLING

Once SMP components are soldered to the board, any

bending or flexure of the PCB applies stresses to the sol-

dered joints of the components. For leaded devices, the

stresses are absorbed by the compliancy of the metal leads

and generally don’t result in problems unless the stress is

large enough to fracture the soldered connection.

Ceramic capacitors are more susceptible to such stress

because they don’t have compliant leads and are brittle in

nature. The most frequent failure mode is low DC resistance

or short circuit. The second failure mode is significant loss

of capacitance due to severing of contact between sets of

the internal electrodes.

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caus ed by the difference in coefficients of expans ion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

Cracks caused by mechanical flexure are very easily identi-

fied and generally take one of the following two general

forms:

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

Cleaning

Type A:

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

Angled crack between bottom of device to top of solder joint.

Type B:

Fracture from top of device to bottom of device.

Mechanical cracks are often hidden underneath the termi-

nation and are difficult to see externally. However, if one end

termination falls off during the removal process from PCB,

this is one indication that the cause of failure was excessive

mechanical stress due to board warping.

72

Surface Mounting Guide

MLC Chip Capacitors

COMMON CAUSES OF

REWORKING OF MLCs

MECHANICAL CRACKING

Thermal shock is common in MLCs that are manually

attached or reworked with a soldering iron. AVX strongly

recommends that any reworking of MLCs be done with hot

air reflow rather than soldering irons. It is practically impossi-

ble to cause any thermal shock in ceramic capacitors when

using hot air reflow.

The most common source for mechanical stress is board

depanelization equipment, such as manual breakapart, v-

cutters and shear presses. Improperly aligned or dull cutters

may cause torqueing of the PCB resulting in flex stresses

being transmitted to components near the board edge.

Another common source of flexural stress is contact during

parametric testing when test points are probed. If the PCB

is allowed to flex during the test cycle, nearby ceramic

capacitors may be broken.

However direct contact by the soldering iron tip often caus-

es thermal cracks that may fail at a later date. If rework by

soldering iron is absolutely necessary, it is recommended

that the wattage of the iron be less than 30 watts and the

tip temperature be <300ºC. Rework should be performed

by applying the solder iron tip to the pad and not directly

contacting any part of the ceramic capacitor.

A third common source is board to board connections at

vertical connectors where cables or other PCBs are con-

nected to the PCB. If the board is not supported during the

plug/unplug cycle, it may flex and cause damage to nearby

components.

Special care should also be taken when handling large (>6"

on a side) PCBs since they more easily flex or warp than

smaller boards.

Solder Tip

Preferred Method - No Direct Part Contact

Poor Method - Direct Contact with Part

PCB BOARD DESIGN

To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of

board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the

MLC is located.

No Stress Relief for MLCs

Routed Cut Line Relieves Stress on MLC

73

USA

AVX Myrtle Beach, SC

Corporate Offices

AVX North Central, IN

AVX Southwest, AZ

Tel: 602-678-0384

FAX: 602-678-0385

AVX Southeast, GA

Tel: 404-608-8151

FAX: 770-972-0766

Tel: 317-848-7153

FAX: 317-844-9314

Tel: 843-448-9411

FAX: 843-448-1943

AVX Mid/Pacific, CA

Tel: 510-661-4100

FAX: 510-661-4101

AVX South Central, TX

AVX Canada

Tel: 905-238-3151

FAX: 905-238-0319

AVX Northwest, WA

Tel: 360-699-8746

FAX: 360-699-8751

Tel: 972-669-1223

FAX: 972-669-2090

EUROPE

AVX Limited, England

AVX S.A., France

Tel: ++33 (1) 69-18-46-00

FAX: ++33 (1) 69-28-73-87

AVX srl, Italy

Tel: ++390 (0)2 614-571

FAX: ++390 (0)2 614-2576

European Headquarters

Tel: ++44 (0) 1252-770000

FAX: ++44 (0) 1252-770001

AVX GmbH, Germany

Tel: ++49 (0) 8131-9004-0

FAX: ++49 (0) 8131-9004-44

AVX Czech Republic

Tel: ++420 465-358-111

FAX: ++420 465-323-010

AVX/ELCO, England

Tel: ++44 (0) 1638-675000

FAX: ++44 (0) 1638-675002

ASIA-PACIFIC

AVX/Kyocera, Singapore

Asia-Pacific Headquarters

AVX/Kyocera, Taiwan

Tel: (886) 2-2698-8778

FAX: (886) 2-2698-8777

Kyocera, Japan - KDP

Tel: (81) 75-604-3424

FAX: (81) 75-604-3425

Tel: (65) 6286-7555

FAX: (65) 6488-9880

AVX/Kyocera, Shanghai, China

AVX/Kyocera, Malaysia

AVX/Kyocera, Hong Kong

Tel: 86-21 6886 1000

FAX: 86-21 6886 1010

Tel: (60) 4-228-1190

FAX: (60) 4-228-1196

Tel: (852) 2-363-3303

FAX: (852) 2-765-8185

AVX/Kyocera, Tianjin, China

Elco, Japan

Tel: 86-22 2576 0098

FAX: 86-22 2576 0096

Tel: 045-943-2906/7

FAX: 045-943-2910

AVX/Kyocera, Korea

Tel: (82) 2-785-6504

FAX: (82) 2-784-5411

Kyocera, Japan - AVX

Tel: (81) 75-604-3426

FAX: (81) 75-604-3425

Contact:

A KYOCERA GROUP COMPANY

http://www.avx.com

S-MLCC10M1204-C


型号：	LD132A272KAB4A
厂家：	KYOCERA AVX
描述：	Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.0027uF, Surface Mount, 1825, CHIP 电容器
文件：	总75页 (文件大小：1144K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LD132A272KAB4A [KYOCERA AVX]

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